Inventor · disambiguated record
Yoshishige Takano
Also filed as: TAKANO YOSHISHIGE
30 granted patents·1 pending application·698 citations·filing 1989–2004
98Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES24HONDA MOTOR CO LTD3INOE AKIHISA1JAPAN ATOMIC ENERGY RES INST1MASUMOTO TSUYOSHI1
Top patents by PatentIndex Score
31 records- 0193US6149737AHigh strength high-toughness aluminum alloy and method of preparing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Nov 21, 2000·66 cites·13 claims
- 0290US5373157AQuadrupole electrode and process for producing the sameJAPAN ATOMIC ENERGY RES INST·Filed 1992·Granted Dec 13, 1994·62 cites·10 claims
- 0389US6533681B2Golf club headINOE AKIHISA·Filed 2001·Granted Mar 18, 2003·61 cites·8 claims
- 0489US5532069AAluminum alloy and method of preparing the sameMASUMOTO TSUYOSHI·Filed 1994·Granted Jul 2, 1996·44 cites·21 claims
- 0586US5824923ASintered friction material, composite copper alloy powder used therefor and manufacturing method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Oct 20, 1998·59 cites·39 claims
- 0684US5922452ATitanium and/or titanium alloy sintered friction materialHONDA MOTOR CO LTD·Filed 1997·Granted Jul 13, 1999·35 cites·16 claims
- 0780US6388273B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted May 14, 2002·21 cites·1 claims
- 0878US5672313AMethod of manufacturing powder molding and powder feederSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Sep 30, 1997·22 cites·7 claims
- 0973US5828127ASemiconductor substate with improved thermal conductivitySUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Oct 27, 1998·46 cites·60 claims
- 1072US6183874B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Feb 6, 2001·28 cites·14 claims
- 1167US6534190B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Mar 18, 2003·9 cites·18 claims
- 1267US5972070ASintered friction material, composite copper alloy powder used therefor and manufacturing method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Oct 26, 1999·23 cites·11 claims
- 1366US5234642AHigh strength silicon nitride sintered body and process for producing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1989·Granted Aug 10, 1993·16 cites·11 claims
- 1464US6042631AALN dispersed powder aluminum alloy and method of preparing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1998·Granted Mar 28, 2000·20 cites·35 claims
- 1564US5976214ASlide member of sintered aluminum alloy and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Nov 2, 1999·25 cites·33 claims
- 1662US6231808B1Tough and heat resisting aluminum alloySUMITOMO ELECTRIC INDUSTRIES·Filed 1998·Granted May 15, 2001·16 cites·2 claims
- 1762US6159419AALN dispersed powder aluminum alloy and method of preparing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Dec 12, 2000·19 cites·14 claims
- 1862US5566449AProcess for producing a shaft clamping memberSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Oct 22, 1996·15 cites·4 claims
- 1962US5498393APowder forging method of aluminum alloy powder having high proof stress and toughnessHONDA MOTOR CO LTD·Filed 1994·Granted Mar 12, 1996·15 cites·24 claims
- 2060US5518519ASintered contact componentSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted May 21, 1996·21 cites·14 claims
- 2157US5498483AWear-resistant sintered ferrous alloy for valve seatSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Mar 12, 1996·15 cites·9 claims
- 2256US6974558B2Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMOTOMO ELECTRIC IND LTD·Filed 2001·Granted Dec 13, 2005·5 cites·9 claims
- 2355US6068094ASintered friction materialHONDA MOTOR CO LTD·Filed 1997·Granted May 30, 2000·12 cites·15 claims
- 2452US5753725ADry friction material and method of preparing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1996·Granted May 19, 1998·11 cites·24 claims
- 2551US5975256ADrum brake especially for a two-wheeled vehicleSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Nov 2, 1999·14 cites·34 claims
- 2642US2005025654A1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Application pending·0 cites
- 2741US5547632APowder forging processSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Aug 20, 1996·8 cites·22 claims
- 2839US5328876AHigh strength silicon nitride sintered body and process for producing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Jul 12, 1994·4 cites·2 claims
- 2935US5225127AProcess for production of sintered silicon nitride made articleSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Jul 6, 1993·3 cites·2 claims
- 3031US5605558ANitrogenous aluminum-silicon powder metallurgical alloySUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Feb 25, 1997·3 cites·8 claims
- 3130US5709758AProcess for producing structural member of aluminum alloySUMITOMO ELECTRIC INDUSTRIES·Filed 1996·Granted Jan 20, 1998·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →