Inventor · disambiguated record
Yoshitaka Taniguchi
Also filed as: TANIGUCHI YOSHITAKA
13 granted patents·8 pending applications·63 citations·filing 2000–2023
86Inventor score
Top patents by PatentIndex Score
21 records- 0189US11268004B2Boron nitride aggregated grainDENKA COMPANY LTD·Filed 2017·Granted Mar 8, 2022·2 cites·5 claims
- 0286US10752503B2Spherical boron nitride fine powder, method for manufacturing same and thermally conductive resin composition using sameDENKA COMPANY LTD·Filed 2017·Granted Aug 25, 2020·2 cites·9 claims
- 0385US6309737B1Circuit substrateDENKI KAGAKU KOGYO KK·Filed 2000·Granted Oct 30, 2001·53 cites·24 claims
- 0469US11732173B2Surface-treated aggregated boron nitride powder, aggregated boron nitride powder, and thermally conductive resin compositionDENKA COMPANY LTD·Filed 2022·Granted Aug 22, 2023·0 cites·8 claims
- 0568US7946030B2Apparatus for assembling components on a target object utilizing a slider for movement of a palletHIRATA SPINNING·Filed 2005·Granted May 24, 2011·5 cites·4 claims
- 0660US2025249459A1Microplate filter plateCSTEC CORP·Filed 2023·Application pending·0 cites
- 0759US10233125B2Aluminium-silicon carbide composite, and power-module base plateDENKA COMPANY LTD·Filed 2015·Granted Mar 19, 2019·1 cites·8 claims
- 0854US12305113B2Heat-conductive resin composition and heat dissipation sheetDENKA COMPANY LTD·Filed 2021·Granted May 20, 2025·0 cites·7 claims
- 0953US11570901B2Method for manufacturing aluminum circuit boardNAT INST MATERIALS SCIENCE·Filed 2018·Granted Jan 31, 2023·0 cites·13 claims
- 1050US11973002B2Composite substrate and method for manufacturing same, and circuit substrate and method for manufacturing sameDENKA COMPANY LTD·Filed 2020·Granted Apr 30, 2024·0 cites·12 claims
- 1150US2009241734A1Method of leaching copper sulfide ores containing chalcopyriteIMAGAWA HARUE·Filed 2009·Application pending·0 cites
- 1249US11160172B2Method for producing ceramic circuit boardDENKA COMPANY LTD·Filed 2018·Granted Oct 26, 2021·0 cites·3 claims
- 1349US2023220262A1Heat dissipation sheetDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 1448US11096278B2Ceramic circuit boardDENKA COMPANY LTD·Filed 2018·Granted Aug 17, 2021·0 cites·11 claims
- 1546US2023052370A1Heat dissipation sheet and method for manufacturing heat dissipation sheetDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 1642US12187608B2Boron nitride powder, method for producing same, and heat-dissipating member produced using sameDENKA COMPANY LTD·Filed 2018·Granted Jan 7, 2025·0 cites·4 claims
- 1742US2021163288A1Hexagonal boron nitride powder and method for producing hexagonal boron nitride powderDENKA COMPANY LTD·Filed 2019·Application pending·0 cites
- 1841US2021261413A1Aggregate boron nitride particles, boron nitride powder, production method for boron nitride powder, resin composition, and heat dissipation memberDENKA COMPANY LTD·Filed 2019·Application pending·0 cites
- 1940US2019364667A1Method for manufacturing ceramic circuit boardUNIV SHINSHU·Filed 2018·Application pending·0 cites
- 2038US11094648B2Power moduleDENKA COMPANY LTD·Filed 2018·Granted Aug 17, 2021·0 cites·8 claims
- 2133US2002037435A1Circuit substrateDENKI KAGAKU KOGYO KK·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →