Inventor · disambiguated record
Yosuke Tanimoto
Also filed as: TANIMOTO YOSUKE
6 granted patents·12 pending applications·3 citations·filing 2016–2022
68Inventor score
Top patents by PatentIndex Score
18 records- 0182US11028474B2Method for cleaning SiC monocrystal growth furnaceSHOWA DENKO KK·Filed 2016·Granted Jun 8, 2021·2 cites·14 claims
- 0267US11114305B2Etching method and semiconductor manufacturing methodSHOWA DENKO KK·Filed 2018·Granted Sep 7, 2021·1 cites·11 claims
- 0361US2020354217A1Hydrogen chloride mixture, method for producing the same, and filling containerSHOWA DENKO KK·Filed 2020·Application pending·0 cites
- 0454US11312625B2Hydrogen sulfide mixture, method for producing same, and filling containerSHOWA DENKO KK·Filed 2017·Granted Apr 26, 2022·0 cites·5 claims
- 0554US2025002432A1Method for producing (e)-1,1,1,4,4,4-hexafluoro-2-buteneRESONAC CORP·Filed 2022·Application pending·0 cites
- 0653US2022250908A1Sulfur dioxide mixture, and method of producing the same, and filling containerSHOWA DENKO KK·Filed 2021·Application pending·0 cites
- 0752US12074038B2Method of manufacturing passivation filmSHOWA DENKO KK·Filed 2020·Granted Aug 27, 2024·0 cites·11 claims
- 0852US2018354790A1Hydrogen chloride mixture, method for producing the same, and filling containerSHOWA DENKO KK·Filed 2016·Application pending·0 cites
- 0951US2025122977A1Gas-filled container and method of storing (e)-1,1,1,4,4,4,-hexafluoro-2-buteneRESONAC CORP·Filed 2021·Application pending·0 cites
- 1045US10611636B2Method for producing hydrogen chlorideSHOWA DENKO KK·Filed 2016·Granted Apr 7, 2020·0 cites·2 claims
- 1145US2023395389A1Etching method and method for producing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1243US2024153778A1Etching gas and etching methodSHOWA DENKO KK·Filed 2022·Application pending·0 cites
- 1341US12116675B2Adhesion removal method and film-forming methodSHOWA DENKO KK·Filed 2019·Granted Oct 15, 2024·0 cites·11 claims
- 1441US2022157599A1Adhered substance removing method and film-forming methodSHOWA DENKO KK·Filed 2020·Application pending·0 cites
- 1541US2022220612A1Method for removing adhering material and film forming methodSHOWA DENKO KK·Filed 2020·Application pending·0 cites
- 1635US2018354789A1Method for producing hydrogen chlorideSHOWA DENKO KK·Filed 2016·Application pending·0 cites
- 1733US2022059327A1Adhesion removal method and film-forming methodSHOWA DENKO KK·Filed 2019·Application pending·0 cites
- 1833US2022064777A1Adhesion removal method and film-forming methodSHOWA DENKO KK·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →