Inventor · disambiguated record
Yoshimitsu Terakado
Also filed as: TERAKADO YOSHIMITSU
27 granted patents·308 citations·filing 1989–2002
96Inventor score
Files withSHINKAWA KK27
Top patents by PatentIndex Score
27 records- 0184US4932584AMethod of wire bondingSHINKAWA KK·Filed 1989·Granted Jun 12, 1990·74 cites·3 claims
- 0258US6595400B2Wire bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 22, 2003·8 cites·3 claims
- 0358US5214259AMethod and apparatus for forming a ball at a bonding wire endSHINKAWA KK·Filed 1992·Granted May 25, 1993·26 cites·3 claims
- 0453US6645346B2Workpiece holding device for a bonding apparatusSHINKAWA KK·Filed 2002·Granted Nov 11, 2003·6 cites·4 claims
- 0553US5024367AWire bonding methodSHINKAWA KK·Filed 1990·Granted Jun 18, 1991·20 cites·2 claims
- 0651US6502738B2Wire bonding apparatusSHINKAWA KK·Filed 2000·Granted Jan 7, 2003·4 cites·3 claims
- 0751US6129255AWire bonding apparatusSHINKAWA KK·Filed 2000·Granted Oct 10, 2000·5 cites·3 claims
- 0850US5468927AWire bonding apparatusSHINKAWA KK·Filed 1994·Granted Nov 21, 1995·17 cites·6 claims
- 0949US5192018AWire bonding methodSHINKAWA KK·Filed 1992·Granted Mar 9, 1993·17 cites·3 claims
- 1049US5016803AWire bonding apparatusSHINKAWA KK·Filed 1989·Granted May 21, 1991·15 cites·3 claims
- 1147US5988482ADischarge abnormality detection device and method for use in wire bonding apparatusSHINKAWA KK·Filed 1998·Granted Nov 23, 1999·14 cites·4 claims
- 1247US5046654AUltrasonic wire bonding apparatusSHINKAWA KK·Filed 1989·Granted Sep 10, 1991·13 cites·2 claims
- 1346US6439496B2Spool holder structure for a wire bonderSHINKAWA KK·Filed 2000·Granted Aug 27, 2002·3 cites·4 claims
- 1446US5058797ADetection method for wire bonding failuresSHINKAWA KK·Filed 1990·Granted Oct 22, 1991·18 cites·2 claims
- 1541US5221037AWire bonding method and apparatusSHINKAWA KK·Filed 1992·Granted Jun 22, 1993·11 cites·4 claims
- 1639US5207370AWire bonding method and apparatusSHINKAWA KK·Filed 1992·Granted May 4, 1993·11 cites·8 claims
- 1737US5975835ALead frame conveying method and conveying apparatusSHINKAWA KK·Filed 1997·Granted Nov 2, 1999·9 cites·5 claims
- 1836US6491203B2Wire bonding apparatusSHINKAWA KK·Filed 2000·Granted Dec 10, 2002·0 cites·2 claims
- 1936US5219112AWire bonding apparatusSHINKAWA KK·Filed 1992·Granted Jun 15, 1993·9 cites·3 claims
- 2034US5524811AWire bonding methodSHINKAWA KK·Filed 1994·Granted Jun 11, 1996·5 cites·7 claims
- 2133US5123585AWire bonding methodSHINKAWA KK·Filed 1990·Granted Jun 23, 1992·6 cites·1 claims
- 2233US5046655ADevice for detecting height of bonding surfaceSHINKAWA KK·Filed 1989·Granted Sep 10, 1991·4 cites·1 claims
- 2331US6141599AMethod for setting conveying data for a lead frameSHINKAWA KK·Filed 1997·Granted Oct 31, 2000·4 cites·4 claims
- 2431US5386936AWire bonding methodSHINKAWA KK·Filed 1993·Granted Feb 7, 1995·3 cites·2 claims
- 2530US5903463ARaising-and-lowering data setting method for magazine elevator deviceSHINKAWA KK·Filed 1997·Granted May 11, 1999·4 cites·2 claims
- 2630US5287064ABonding point polarity determining apparatusSHINKAWA KK·Filed 1992·Granted Feb 15, 1994·0 cites·2 claims
- 2729US5485063AMotor control circuit for a wire bonding apparatusSHINKAWA KK·Filed 1993·Granted Jan 16, 1996·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →