Inventor · disambiguated record

Yoshihiro Tohyama

Also filed as: TOHYAMA YOSHIHIRO

1 granted patent·19 citations·filing 1996–1996

39Inventor score

Technology areasH10P

Files withFUJITSU LTD1

Top patents by PatentIndex Score

1 record

0145US5930654AMethod of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tapeFUJITSU LTD·Filed 1996·Granted Jul 27, 1999·19 cites·9 claims

Join the waitlist — get patent alerts

Get an alert when Yoshihiro Tohyama files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →