Inventor · disambiguated record
Yoshihiro Tomita
Also filed as: TOMITA YOSHIHIRO
134 granted patents·41 pending applications·2,738 citations·filing 1987–2024
99Inventor score
Files withINTEL CORP51MATSUSHITA ELECTRIC INDUSTRIAL CO LTD29MITSUBISHI ELECTRIC CORP22PANASONIC CORP15PANASONIC IP MAN CO LTD15
Top patents by PatentIndex Score
175 records- 0198US9844133B2Flexible substrate including stretchable sheetPANASONIC IP MAN CO LTD·Filed 2016·Granted Dec 12, 2017·29 cites·19 claims
- 0298US5771555AMethod for producing an electronic component using direct bondingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 30, 1998·273 cites·6 claims
- 0397US11387200B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 0496US11955434B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2022·Granted Apr 9, 2024·2 cites·22 claims
- 0596US5900582ALead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted May 4, 1999·106 cites·2 claims
- 0694US11075166B2Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrateINTEL CORP·Filed 2020·Granted Jul 27, 2021·3 cites·18 claims
- 0794US10365172B2Tactile sensor that includes two sheets each having at least either flexibility or elasticityPANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 30, 2019·16 cites·14 claims
- 0894US9899238B2Low cost package warpage solutionINTEL CORP·Filed 2014·Granted Feb 20, 2018·11 cites·13 claims
- 0994US6459152B1Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surfaceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 1, 2002·67 cites·3 claims
- 1094US5666706AMethod of manufacturing a piezoelectric acoustic wave deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 16, 1997·103 cites·9 claims
- 1193US10418329B2Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrateINTEL CORP·Filed 2015·Granted Sep 17, 2019·11 cites·23 claims
- 1293US5535509AMethod of making a lead on chip (LOC) semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jul 16, 1996·68 cites·6 claims
- 1392US10573608B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on packageINTEL CORP·Filed 2015·Granted Feb 25, 2020·9 cites·22 claims
- 1492US7184617B2Portable deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Feb 27, 2007·29 cites·6 claims
- 1592US5759753APiezoelectric device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 2, 1998·68 cites·11 claims
- 1691US10741419B2Low cost package warpage solutionINTEL CORP·Filed 2019·Granted Aug 11, 2020·4 cites·20 claims
- 1791US8723574B2Semiconductor integrated circuitTOMITA YOSHIHIRO·Filed 2012·Granted May 13, 2014·14 cites·20 claims
- 1891US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 1991US6426583B1Surface acoustic wave element, method for producing the same and surface acoustic wave device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jul 30, 2002·44 cites·14 claims
- 2090US10070520B2Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrierINTEL CORP·Filed 2015·Granted Sep 4, 2018·6 cites·18 claims
- 2190US5910699AMethod of manufacturing a composite substrate and a piezoelectric device using the substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 8, 1999·53 cites·10 claims
- 2290US5440169AResin-packaged semiconductor device with flow prevention dimplesMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 8, 1995·117 cites·5 claims
- 2389US10228806B2Flexible touch sensor and method of manufacturing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 12, 2019·6 cites·18 claims
- 2489US6084294ASemiconductor device comprising stacked semiconductor elementsMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 4, 2000·102 cites·8 claims
- 2589US5982010APiezoelectric device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Nov 9, 1999·50 cites·10 claims
- 2689US5969463AEnergy trapping piezoelectric device and producing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Oct 19, 1999·72 cites·13 claims
- 2789US5929555APiezoelectric resonator and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 27, 1999·50 cites·13 claims
- 2889US2025096009A1Low cost package warpage solutionINTEL CORP·Filed 2024·Application pending·0 cites
- 2988US10629551B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Apr 21, 2020·5 cites·19 claims
- 3088US5666008AFlip chip semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 9, 1997·114 cites·18 claims
- 3187US9860979B2Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layerPANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 2, 2018·5 cites·12 claims
- 3286US9543197B2Package with dielectric or anisotropic conductive (ACF) buildup layerINTEL CORP·Filed 2012·Granted Jan 10, 2017·7 cites·23 claims
- 3386US7910403B2Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·12 cites·10 claims
- 3485US12183596B2Low cost package warpage solutionINTEL CORP·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 3585US9576942B1Integrated circuit assembly that includes stacked diceINTEL CORP·Filed 2015·Granted Feb 21, 2017·4 cites·14 claims
- 3685US6270202B1Liquid jetting apparatus having a piezoelectric drive element directly bonded to a casingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Aug 7, 2001·51 cites·19 claims
- 3785US6098460AAcceleration sensor and shock detecting device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 8, 2000·50 cites·27 claims
- 3885US5925973AElectronic component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 20, 1999·48 cites·44 claims
- 3984US11328937B2Low cost package warpage solutionINTEL CORP·Filed 2020·Granted May 10, 2022·1 cites·33 claims
- 4083US10163810B2Electromagnetic interference shielding for system-in-package technologyINTEL CORP·Filed 2015·Granted Dec 25, 2018·4 cites·19 claims
- 4183US9502368B2Picture frame stiffeners for microelectronic packagesINTEL CORP·Filed 2014·Granted Nov 22, 2016·5 cites·11 claims
- 4283US5763829ALeadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframeMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 9, 1998·38 cites·2 claims
- 4382US8110920B2In-package microelectronic apparatus, and methods of using sameDATTAGURU SRIRAM·Filed 2009·Granted Feb 7, 2012·11 cites·2 claims
- 4482US7882628B2Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-viasINTEL CORP·Filed 2007·Granted Feb 8, 2011·13 cites·15 claims
- 4582US7841080B2Multi-chip packaging using an interposer with through-viasINTEL CORP·Filed 2007·Granted Nov 30, 2010·10 cites·8 claims
- 4682US7514116B2Horizontal Carbon Nanotubes by Vertical Growth and RollingINTEL CORP·Filed 2005·Granted Apr 7, 2009·9 cites·14 claims
- 4782US7106526B2Thin imaging apparatus, a thin camera, and an imaging methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 12, 2006·11 cites·40 claims
- 4882US7094630B2Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surfaceRENESAS TECH CORP·Filed 2004·Granted Aug 22, 2006·23 cites·2 claims
- 4982US5698471AMethod of manufacturing a composite substrate and a piezoelectric device using the substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Dec 16, 1997·35 cites·13 claims
- 5081US9942980B2Wavy interconnect for bendable and stretchable devicesINTEL CORP·Filed 2014·Granted Apr 10, 2018·5 cites·21 claims
Showing the top 50 of 175 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →