Inventor · disambiguated record
Yoji Ueda
Also filed as: UEDA YOJI
15 granted patents·9 pending applications·276 citations·filing 2001–2020
91Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD13TORAY INDUSTRIES8KATSURA HIROAKI1KYOCERA DOCUMENT SOLUTIONS INC1
Top patents by PatentIndex Score
24 records- 0195US6459046B1Printed circuit board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 1, 2002·86 cites·9 claims
- 0293US6799369B2Printed circuit board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Oct 5, 2004·52 cites·9 claims
- 0390US6518514B2Circuit board and production of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 11, 2003·48 cites·17 claims
- 0489US6753483B2Printed circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 22, 2004·36 cites·11 claims
- 0588US6691409B2Method of producing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·40 cites·9 claims
- 0675US7423884B2Multilayer circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 9, 2008·9 cites·11 claims
- 0757US7155820B2Method for manufacturing printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 2, 2007·5 cites·10 claims
- 0853US12398417B2Nucleic acid separation method, detection method, nucleic acid purification column and method of producing sameTORAY INDUSTRIES·Filed 2020·Granted Aug 26, 2025·0 cites·13 claims
- 0953US2008185178A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 1052US9416403B2Method of detecting target nucleic acidTORAY INDUSTRIES·Filed 2013·Granted Aug 16, 2016·0 cites·2 claims
- 1150US2015045249A1Nucleic acid detection methodTORAY INDUSTRIES·Filed 2013·Application pending·0 cites
- 1249US12227787B2Method of evaluating quality of dephosphorylation reagent and method of detecting target nucleic acidTORAY INDUSTRIES·Filed 2019·Granted Feb 18, 2025·0 cites·7 claims
- 1348US10642196B2Cleaning device and image forming apparatus therewithKYOCERA DOCUMENT SOLUTIONS INC·Filed 2019·Granted May 5, 2020·0 cites·6 claims
- 1448US2008186045A1Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 1547US10443085B2Method for detecting nucleic acid and nucleic acid detection kitTORAY INDUSTRIES·Filed 2013·Granted Oct 15, 2019·0 cites·3 claims
- 1645US11999978B2Alkaline phosphatase composition, method of producing dephosphorylated nucleic acid and method of producing labeled nucleic acidTORAY INDUSTRIES·Filed 2019·Granted Jun 4, 2024·0 cites·14 claims
- 1744US2005124197A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 1843US10676783B2Analysis chipTORAY INDUSTRIES·Filed 2016·Granted Jun 9, 2020·0 cites·20 claims
- 1943US2021332337A1Alkaline phosphatase composition, method of producing dephosphorylated nucleic acid and method of producing labeled nucleic acidTORAY INDUSTRIES·Filed 2019·Application pending·0 cites
- 2042US2009032285A1Multi-layer circuit substrate manufacturing method and multi-layer circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2141US2005016764A1Wiring substrate for intermediate connection and multi-layered wiring board and their productionFiled 2004·Application pending·0 cites
- 2240US2004214006A1Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boardsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 2339US2003137815A1Printed wiring board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 2432US8867228B2Electrode bonding structure, and manufacturing method for electrode bonding structureKATSURA HIROAKI·Filed 2012·Granted Oct 21, 2014·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →