Inventor · disambiguated record

Youichi Usui

Also filed as: USUI YOUICHI

7 granted patents·12 citations·filing 2013–2019

79Inventor score

Technology areasH10P

Files withHOYA CORP7

Top patents by PatentIndex Score

7 records

0191US10001699B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2016·Granted Jun 19, 2018·6 cites·14 claims
0281US9897909B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2016·Granted Feb 20, 2018·2 cites·8 claims
0375US9348217B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2013·Granted May 24, 2016·2 cites·15 claims
0474US9494851B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2013·Granted Nov 15, 2016·2 cites·30 claims
0565US10620527B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
0660US10429728B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2017·Granted Oct 1, 2019·0 cites·21 claims
0760US10295900B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2018·Granted May 21, 2019·0 cites·26 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →