Inventor · disambiguated record
Yoshiaki Wakashima
Also filed as: WAKASHIMA YOSHIAKI
16 granted patents·1,631 citations·filing 1974–2001
96Inventor score
Top patents by PatentIndex Score
16 records- 0199US4982265ASemiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1988·Granted Jan 1, 1991·620 cites·4 claims
- 0297US5198888ASemiconductor stacked deviceHITACHI LTD·Filed 1990·Granted Mar 30, 1993·353 cites·11 claims
- 0396US5910685ASemiconductor memory module having double-sided stacked memory chip layoutHITACHI LTD·Filed 1997·Granted Jun 8, 1999·87 cites·14 claims
- 0494US5028986ASemiconductor device and semiconductor module with a plurality of stacked semiconductor devicesHITACHI LTD·Filed 1988·Granted Jul 2, 1991·115 cites·34 claims
- 0592US5334875AStacked semiconductor memory device and semiconductor memory module containing the sameHITACHI LTD·Filed 1993·Granted Aug 2, 1994·128 cites·56 claims
- 0684US6268648B1Board for mounting semiconductor element, method for manufacturing the same, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jul 31, 2001·83 cites·37 claims
- 0779US6492203B1Semiconductor device and method of fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2000·Granted Dec 10, 2002·30 cites·8 claims
- 0875US4064289AMethod of making a semiconductor deviceHITACHI LTD·Filed 1975·Granted Dec 20, 1977·30 cites·7 claims
- 0973US3939488AMethod of manufacturing semiconductor device and resulting productHITACHI LTD·Filed 1974·Granted Feb 17, 1976·17 cites·24 claims
- 1071US4977441ASemiconductor device and tape carrierHITACHI LTD·Filed 1990·Granted Dec 11, 1990·53 cites·27 claims
- 1170US4523371AMethod of fabricating a resin mold type semiconductor deviceWAKASHIMA YOSHIAKI·Filed 1982·Granted Jun 18, 1985·35 cites·11 claims
- 1266US3946427ASemiconductor deviceHITACHI LTD·Filed 1974·Granted Mar 23, 1976·15 cites·8 claims
- 1364US4792532ASemiconductor device and process for producing the same, and tape carrier used in said processHITACHI LTD·Filed 1986·Granted Dec 20, 1988·34 cites·9 claims
- 1463US4494217ASemiconductor memories with α shieldHITACHI LTD·Filed 1981·Granted Jan 15, 1985·24 cites·17 claims
- 1556US6708398B2Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 23, 2004·7 cites·10 claims
- 1626US4322593AApparatus for pre-heating resin tabletHITACHI LTD·Filed 1979·Granted Mar 30, 1982·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →