Inventor · disambiguated record
Yongming Xiong
Also filed as: XIONG YONGMING
13 granted patents·3 pending applications·111 citations·filing 2002–2022
90Inventor score
Top patents by PatentIndex Score
16 records- 0195US10091873B1Printed circuit board and integrated circuit packageINNOVIUM INC·Filed 2017·Granted Oct 2, 2018·18 cites·34 claims
- 0295US9433081B1Differential signal crosstalk minimization for dual striplineCISCO TECH INC·Filed 2014·Granted Aug 30, 2016·53 cites·19 claims
- 0394US11916325B1Circuit board devices with reconfigurable connectionsINNOVIUM INC·Filed 2021·Granted Feb 27, 2024·4 cites·11 claims
- 0493US10244629B1Printed circuit board including multi-diameter viasINNOVIUM INC·Filed 2017·Granted Mar 26, 2019·15 cites·26 claims
- 0591US9996653B1Techniques for optimizing dual track routingCISCO TECH INC·Filed 2014·Granted Jun 12, 2018·12 cites·8 claims
- 0690US10251270B2Dual-drill printed circuit board viaINNOVIUM INC·Filed 2016·Granted Apr 2, 2019·7 cites·15 claims
- 0783US11924966B1Reconfigurable circuit devicesINNOVIUM INC·Filed 2021·Granted Mar 5, 2024·1 cites·9 claims
- 0867US9690895B2Triangular routing for high speed differential pair length matchingCISCO TECH INC·Filed 2014·Granted Jun 27, 2017·1 cites·20 claims
- 0966US12369257B1Circuit fabrication method that includes reconfiguration of via connections between circuit elementsINNOVIUM INC·Filed 2021·Granted Jul 22, 2025·0 cites·12 claims
- 1060US10776553B2Techniques for optimizing dual track routingCISCO TECH INC·Filed 2018·Granted Sep 15, 2020·0 cites·18 claims
- 1158US2019208631A1Dual-drill printed circuit board viaINNOVIUM INC·Filed 2019·Application pending·0 cites
- 1256US10325053B2Triangular routing for high speed differential pair length matchingCISCO TECH INC·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 1352US10716207B2Printed circuit board and integrated circuit packageINNOVIUM INC·Filed 2018·Granted Jul 14, 2020·0 cites·21 claims
- 1440US2003214481A1Finger worn and operated input device and method of useFiled 2002·Application pending·0 cites
- 1536US2018184524A1Mixed ball grid array pitch for integrated circuit packageINNOVIUM INC·Filed 2016·Application pending·0 cites
- 1633USD1087043SIntegrated circuit substrateMARVELL ASIA PTE LTD·Filed 2022·Granted Aug 5, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →