Inventor · disambiguated record
Yongjing Xu
Also filed as: XU YONGJING
16 granted patents·9 pending applications·6 citations·filing 2013–2022
85Inventor score
Top patents by PatentIndex Score
25 records- 0183US10240074B2Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods thereforSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Mar 26, 2019·3 cites·20 claims
- 0282US11930595B2Circuit material and circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·16 claims
- 0374US12466937B2Resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·16 claims
- 0464US12378386B2Resin composition and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·16 claims
- 0561US11732123B2Thermosetting resin composition, and prepreg, laminate and printed circuit board using sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Aug 22, 2023·0 cites·19 claims
- 0661US11584851B2Resin composition, and prepreg and circuit material using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 0760US10645806B2Polyphenyl ether resin composition and use thereof in high-frequency circuit substrateSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted May 5, 2020·1 cites·19 claims
- 0860US10513608B2Process for preparing resin composition comprising benzoxazine, prepreg and laminate prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·19 claims
- 0956US12234318B2Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin compositionSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Feb 25, 2025·0 cites·16 claims
- 1054US12122904B2Thermosetting resin composition and prepreg, laminate and printed circuit board using sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·19 claims
- 1154US2024010810A1Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 1253US10513605B2Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·11 claims
- 1353US2016255718A1An epoxy resin composition, and prepreg and copper-clad laminate made by using sameXIN YUJUN·Filed 2014·Application pending·0 cites
- 1451US10400173B2Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·22 claims
- 1548US2022135788A1Resin composition, prepreg containing same, and laminate board and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 1647US10400099B2Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Sep 3, 2019·0 cites·15 claims
- 1747US10208156B2Epoxy resin composition, prepreg and laminate using sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Feb 19, 2019·0 cites·22 claims
- 1843US2016108230A1Cyanate resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1942US2016115313A1Cyanate resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2041US2016007452A1Circuit substrate and process for preparing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 2141US2018126701A1Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit boards using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 2241US2022210914A1Copper clad laminate and printed-circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 2340US2018371232A1Halogen-free Flame Retardant Resin Composition, Prepreg and Copper Clad Laminate Prepared TherefromSHENGYI TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
- 2438US10494502B2Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Dec 3, 2019·0 cites·20 claims
- 2533US11191158B2Circuit board and process for preparing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Nov 30, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →