Inventor · disambiguated record
Youzhi E. Xu
Also filed as: XU YOUZHI · XU YOUZHI E
6 granted patents·2 pending applications·53 citations·filing 2002–2013
82Inventor score
Top patents by PatentIndex Score
8 records- 0184US6761813B2Heat transfer through covalent bonding of thermal interface materialINTEL CORP·Filed 2002·Granted Jul 13, 2004·25 cites·23 claims
- 0281US7926697B2Underfill formulation and method of increasing an adhesion property of sameINTEL CORP·Filed 2007·Granted Apr 19, 2011·7 cites·11 claims
- 0377US7704798B2Electronic assemblies with hot spot cooling and methods relating theretoINTEL CORP·Filed 2008·Granted Apr 27, 2010·7 cites·19 claims
- 0476US9036612B2Wireless communication method and system with collision avoidance protocolGIDLUND MIKAEL·Filed 2013·Granted May 19, 2015·5 cites·16 claims
- 0576US7489033B2Electronic assembly with hot spot coolingINTEL CORP·Filed 2006·Granted Feb 10, 2009·7 cites·13 claims
- 0673US8354467B2Underfill formulation and method of increasing an adhesion property of sameINTEL CORP·Filed 2011·Granted Jan 15, 2013·2 cites·2 claims
- 0740US2009170247A1Magnetic particles for low temperature cure of underfillSHEKHAWAT LINDA A·Filed 2007·Application pending·0 cites
- 0837US2004164383A1Heat transfer through covalent bonding of thermal interface materialFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →