Inventor · disambiguated record
Yoshihiko Yagi
Also filed as: YAGI YOSHIHIKO
27 granted patents·1 pending application·398 citations·filing 1995–2017
96Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD10PANASONIC CORP8SAKURAI DAISUKE5HITACHI INFORMATION & TELECOMMUNICATION ENG LTD2MORI MASATO2
Top patents by PatentIndex Score
28 records- 0190US5686353ASemiconductor device and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 11, 1997·119 cites·12 claims
- 0287US7762819B2Substrate connecting member and connecting structurePANASONIC CORP·Filed 2006·Granted Jul 27, 2010·14 cites·11 claims
- 0385US8018731B2Interconnect substrate and electronic circuit mounted structurePANASONIC CORP·Filed 2007·Granted Sep 13, 2011·13 cites·5 claims
- 0485US7845954B2Interconnecting board and three-dimensional wiring structure using itPANASONIC CORP·Filed 2006·Granted Dec 7, 2010·13 cites·8 claims
- 0583US8575751B2Conductive bump, method for producing the same, and electronic component mounted structureSAKURAI DAISUKE·Filed 2008·Granted Nov 5, 2013·6 cites·9 claims
- 0682US8208270B2Substrate joining member and three-dimensional structure using the sameMORI MASATO·Filed 2007·Granted Jun 26, 2012·12 cites·13 claims
- 0781US8159829B2Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrateMORI MASATO·Filed 2007·Granted Apr 17, 2012·10 cites·8 claims
- 0880US8120188B2Electronic component mounting structure and method for manufacturing the sameSAKURAI DAISUKE·Filed 2007·Granted Feb 21, 2012·8 cites·10 claims
- 0980US7071090B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 4, 2006·7 cites·5 claims
- 1079US8134081B2Three-dimensional circuit board and its manufacturing methodSAKURAI DAISUKE·Filed 2007·Granted Mar 13, 2012·7 cites·7 claims
- 1179US6207549B1Method of forming a ball bond using a bonding capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 27, 2001·45 cites·32 claims
- 1276US7613010B2Stereoscopic electronic circuit device, and relay board and relay frame used thereinPANASONIC CORP·Filed 2004·Granted Nov 3, 2009·17 cites·25 claims
- 1375US6651320B1Method for mounting semiconductor element to circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 25, 2003·49 cites·6 claims
- 1472US8033016B2Method for manufacturing an electrode and electrode component mounted bodyPANASONIC CORP·Filed 2006·Granted Oct 11, 2011·6 cites·10 claims
- 1571US8119449B2Method of manufacturing an electronic part mounting structureSAKURAI DAISUKE·Filed 2007·Granted Feb 21, 2012·5 cites·4 claims
- 1668US6061248ASemiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereonMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 9, 2000·29 cites·10 claims
- 1767US9402092B2Communication device, communication program, and communication methodHITACHI INFORMATION & TELECOMMUNICATION ENG LTD·Filed 2014·Granted Jul 26, 2016·3 cites·5 claims
- 1867US7928566B2Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor devicePANASONIC CORP·Filed 2007·Granted Apr 19, 2011·3 cites·15 claims
- 1967US6985363B2Card type recording medium and production method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 10, 2006·16 cites·32 claims
- 2058US6894387B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 17, 2005·6 cites·17 claims
- 2157US2010008056A1Stereoscopic electronic circuit device, and relay board and relay frame used thereinPANASONIC CORP·Filed 2009·Application pending·0 cites
- 2251US8809693B2Three-dimensional circuit boardSAKURAI DAISUKE·Filed 2012·Granted Aug 19, 2014·0 cites·21 claims
- 2351US6966964B2Method and apparatus for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 22, 2005·6 cites·5 claims
- 2450US10363685B2Ingot cutting apparatus, and load detecting device used in ingot cutting apparatusTEC GIHAN CO LTD·Filed 2017·Granted Jul 30, 2019·0 cites·16 claims
- 2546US9438379B2Communication device, communication program, communication method, and information processing deviceHITACHI INFORMATION & TELECOMMUNICATION ENG LTD·Filed 2014·Granted Sep 6, 2016·0 cites·7 claims
- 2641US6787922B2Semiconductor chip—mounting boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 7, 2004·0 cites·5 claims
- 2740US7659148B2Bonding method and apparatusPANASONIC CORP·Filed 2005·Granted Feb 9, 2010·0 cites·13 claims
- 2836US6566165B1Method for mounting a semiconductor chip to a semiconductor chip-mounting boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 20, 2003·4 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Yoshihiko Yagi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →