Inventor · disambiguated record
Yoshie Yamanaka
Also filed as: YAMANAKA YOSHIE
8 granted patents·5 pending applications·13 citations·filing 2009–2024
80Inventor score
Files withSENJU METAL INDUSTRY CO6YOSHIKAWA SHUNSAKU2OHNISHI TSUKASA1SAKAMOTO YOSHITSUGU1SHIMAMURA MASATO1
Top patents by PatentIndex Score
13 records- 0181US2024363571A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0276US9527167B2Lead-free solder ballOHNISHI TSUKASA·Filed 2012·Granted Dec 27, 2016·4 cites·13 claims
- 0375US9780055B2Lead-free solder ballYAMANAKA YOSHIE·Filed 2012·Granted Oct 3, 2017·4 cites·11 claims
- 0475US9700963B2Lead-free solder ballSENJU METAL INDUSTRY CO·Filed 2016·Granted Jul 11, 2017·2 cites·14 claims
- 0556US9844837B2Lead-free solder alloySHIMAMURA MASATO·Filed 2012·Granted Dec 19, 2017·1 cites·5 claims
- 0656US8975757B2Lead-free solder connection structure and solder ballUESHIMA MINORU·Filed 2009·Granted Mar 10, 2015·1 cites·20 claims
- 0756US2019088611A1"Lead-Free Solder Ball"SENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 0854US8896119B2Bonding material for semiconductor devicesSAKAMOTO YOSHITSUGU·Filed 2011·Granted Nov 25, 2014·1 cites·11 claims
- 0953US2018005970A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2017·Application pending·0 cites
- 1050US10076808B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Sep 18, 2018·0 cites·7 claims
- 1150US2019076966A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1245US9773721B2Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2014·Granted Sep 26, 2017·0 cites·15 claims
- 1336US2012199393A1Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →