Inventor · disambiguated record
Yuhong Cai
Also filed as: CAI YUHONG
13 granted patents·3 pending applications·6 citations·filing 2004–2024
83Inventor score
Top patents by PatentIndex Score
16 records- 0174US11901264B2Choked flow coolingSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2018·Granted Feb 13, 2024·2 cites·25 claims
- 0273US12266591B2Choked flow coolingSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2024·Granted Apr 1, 2025·0 cites·16 claims
- 0370US10192840B2Ball pad with a plurality of lobesINTEL CORP·Filed 2015·Granted Jan 29, 2019·2 cites·20 claims
- 0469US12068283B2Die stack with cascade and vertical connectionsINTEL CORP·Filed 2021·Granted Aug 20, 2024·0 cites·15 claims
- 0568US10051763B2Local stress-relieving devices, systems, and methods for electronic assembliesINTEL CORP·Filed 2016·Granted Aug 14, 2018·2 cites·16 claims
- 0657US10573575B2Semiconductor package with thermal finsINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·24 claims
- 0751US11569144B2Semiconductor package design for solder joint reliabilityINTEL CORP·Filed 2018·Granted Jan 31, 2023·0 cites·13 claims
- 0851US11476174B2Solder mask design for delamination preventionINTEL CORP·Filed 2018·Granted Oct 18, 2022·0 cites·25 claims
- 0950US11848292B2Pad design for thermal fatigue resistance and interconnect joint reliabilityINTEL CORP·Filed 2018·Granted Dec 19, 2023·0 cites·25 claims
- 1050US11171114B2Die stack with cascade and vertical connectionsINTEL CORP·Filed 2015·Granted Nov 9, 2021·0 cites·7 claims
- 1148US11694976B2Bowl shaped padINTEL CORP·Filed 2018·Granted Jul 4, 2023·0 cites·16 claims
- 1246US11894334B2Dual head capillary design for vertical wire bondINTEL CORP·Filed 2018·Granted Feb 6, 2024·0 cites·10 claims
- 1345US11948917B2Die over mold stacked semiconductor packageINTEL CORP·Filed 2019·Granted Apr 2, 2024·0 cites·21 claims
- 1441US2004237066A1Software design system and methodAUCKLAND UNISERVICES LTD·Filed 2004·Application pending·0 cites
- 1533US2019035720A1Stress distribution interposer for mitigating substrate crackingINTEL CORP·Filed 2016·Application pending·0 cites
- 1627US2017186701A1Crack resistant electronic device package substratesINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →