Inventor · disambiguated record
Yung-Shun Chang
Also filed as: CHANG YUNG-SHUN
17 granted patents·3 pending applications·51 citations·filing 2015–2024
89Inventor score
Files withADVANCED SEMICONDUCTOR ENG20
Top patents by PatentIndex Score
20 records- 0197US9837352B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Dec 5, 2017·41 cites·22 claims
- 0285US11508655B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·2 cites·18 claims
- 0383US11887928B2Package structure with interposer encapsulated by an encapsulantADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 30, 2024·1 cites·7 claims
- 0477US11276620B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·2 cites·20 claims
- 0577US10838144B2Semiconductor device packagesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 17, 2020·2 cites·19 claims
- 0675US9577027B2Semiconductor device and process of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Feb 21, 2017·2 cites·17 claims
- 0775US2025125209A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0868US12176259B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 24, 2024·0 cites·3 claims
- 0968US11373967B2Semiconductor device package and method for packaging the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 28, 2022·1 cites·13 claims
- 1066US12300602B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 13, 2025·0 cites·17 claims
- 1164US11495572B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 1262US11515241B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 29, 2022·0 cites·18 claims
- 1355US10950531B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 1454US10741523B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Aug 11, 2020·0 cites·18 claims
- 1553US11621220B2Assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 4, 2023·0 cites·17 claims
- 1652US10241264B2Semiconductor device packagesADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 26, 2019·0 cites·19 claims
- 1752US9929132B2Semiconductor device and process of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 27, 2018·0 cites·20 claims
- 1845US10861840B2Integrated passive component and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 8, 2020·0 cites·29 claims
- 1940US2020381345A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 2036US2018138113A1Semiconductor system and device package including interconnect structureADVANCED SEMICONDUCTOR ENG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →