Inventor · disambiguated record
Yun-Hao Chang
Also filed as: CHANG YUN-HAO
0 granted patents·4 pending applications·0 citations·filing 2008–2010
Files withHARVATEK CORP4
Top patents by PatentIndex Score
4 records- 0153US2009230538A1Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 0245US2011003434A1Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2010·Application pending·0 cites
- 0345US2009283881A1Semiconductor chip package structure for achieving face-down electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 0445US2009278159A1Semiconductor chip package structure without substrates for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yun-Hao Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →