Inventor · disambiguated record
Yu-Hsiang Chao
Also filed as: CHAO YU-HSIANG
6 granted patents·3 pending applications·23 citations·filing 2015–2024
77Inventor score
Top patents by PatentIndex Score
9 records- 0191US10256173B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 9, 2019·13 cites·17 claims
- 0290US11521939B2Semiconductor device structure having stiffener with two or more contact points for heat dissipating elementADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 6, 2022·4 cites·8 claims
- 0382US10265829B2Chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·4 cites·20 claims
- 0479US10986036B1Method and apparatus for orchestrating resources in multi-access edge computing (MEC) networkHON LIN TECH CO LTD·Filed 2020·Granted Apr 20, 2021·2 cites·20 claims
- 0570US2024371708A1Systems and methods for suction pad assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0665US12087646B2Systems and methods for suction pad assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0759US2019247974A1Method for polishing waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
- 0854US11328965B2Systems and methods for suction pad assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 10, 2022·0 cites·20 claims
- 0946US2023063687A1Apparatus for polishing a waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →