Inventor · disambiguated record
Yujen Chen
Also filed as: CHEN YUJEN
3 granted patents·16 pending applications·2 citations·filing 2014–2024
49Inventor score
Top patents by PatentIndex Score
19 records- 0165US10877335B2Liquid crystal display device and method for improving color difference of viewing angles of liquid crystal display deviceHKC CORP LTD·Filed 2017·Granted Dec 29, 2020·2 cites·16 claims
- 0258US2025385169A1Device comprising wall pillar interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0357US2025357288A1Package comprising a substrate, an integrated device and an interconnect over the integrated deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0457US2025329648A1Conductive paste vss shorting for ground bumpsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0556US2025300134A1Package substrate having stacked electronic component structure disposed in a cavity of a coreQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0656US2025246590A1Integrated devices having multiple die orientationsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0754US2025087611A1Integrated device comprising a pillar shell interconnect and an inner solder interconnectQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0854US2025293111A1Lid through interposer of semiconductor package for thermal managementQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0954US2025300133A13d stacking with through-mold cavity for thermal managementQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1053US11721656B2Integrated device comprising pillar interconnect with cavityQUALCOMM INC·Filed 2021·Granted Aug 8, 2023·0 cites·25 claims
- 1153US2025201687A1Substrate structure including stacked substrates disposed in a shellQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1252US2024387429A1Integrated circuit (ic) chip with bump interconnects each having multiple contact areas, related ic packages, and methods of fabricationQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1352US2024413112A1Integrated circuit device including multi-layer interconnect pillarQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1450US2024096845A1Circuit packages with bump interconnect polymer surround and method of manufactureQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1545US2023082120A1Integrated device comprising pillar interconnects with variable shapesQUALCOMM INC·Filed 2021·Application pending·0 cites
- 1638US2015370391A1Touch display device and process for manufacturing the sameEVERDISPLAY OPTRONICS SHANGHAI LTD·Filed 2014·Application pending·0 cites
- 1736US10573251B2Liquid crystal display device and method for driving the sameHKC CORP LTD·Filed 2017·Granted Feb 25, 2020·0 cites·18 claims
- 1823US2015194472A1Pixel structure for display panel and display panelEVERDISPLAY OPTRONICS SHANGHAI LTD·Filed 2015·Application pending·0 cites
- 1922US2016364054A1Encapsulating Structure of Display Panel and Method for the Display PanelEVERDISPLAY OPTRONICS (SHANGHAI) LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →