Inventor · disambiguated record
Yung-Shih Chen
Also filed as: CHEN YUNG-SHIH
2 granted patents·130 citations·filing 1983–1997
67Inventor score
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2 records- 0190US5825084ASingle-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devicesEXPRESS PACKAGING SYSTEMS INC·Filed 1997·Granted Oct 20, 1998·117 cites·22 claims
- 0245US4486511ASolder composition for thin coatingsNAT SEMICONDUCTOR CORP·Filed 1983·Granted Dec 4, 1984·13 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →