Inventor · disambiguated record
Yu-Feng Chen
Also filed as: CHEN YU · CHEN YU-FENG
108 granted patents·13 pending applications·425 citations·filing 2000–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD73TAIWAN SEMICONDUCTOR MFG12MICRON TECHNOLOGY INC9AUDIOWISE TECH INC4CHEN YU-FENG4
Top patents by PatentIndex Score
121 records- 0199US9881850B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·56 cites·20 claims
- 0297US9691708B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·26 cites·20 claims
- 0396US9640521B2Multi-die package with bridge layer and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·15 cites·20 claims
- 0495US9589941B1Multi-chip package system and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·10 cites·20 claims
- 0595US8981559B2Package on package devices and methods of packaging semiconductor diesHSU CHUN-LEI·Filed 2012·Granted Mar 17, 2015·50 cites·20 claims
- 0695US8288871B1Reduced-stress bump-on-trace (BOT) structuresSHIEH YUH CHERN·Filed 2011·Granted Oct 16, 2012·53 cites·20 claims
- 0793US10707094B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 7, 2020·6 cites·20 claims
- 0893US10276402B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·8 cites·19 claims
- 0992US11570605B2Bluetooth communication system, electronic device and Bluetooth chip having low power consumptionAUDIOWISE TECH INC·Filed 2021·Granted Jan 31, 2023·2 cites·10 claims
- 1092US9553065B2Bumps for chip scale packaging including under bump metal structures with different diametersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 24, 2017·12 cites·18 claims
- 1192US9190348B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 17, 2015·9 cites·20 claims
- 1291US9871013B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 16, 2018·10 cites·20 claims
- 1390US10268868B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·4 cites·20 claims
- 1490US10157874B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·6 cites·20 claims
- 1590US9502360B2Stress compensation layer for 3D packagingLIN CHUN-HUNG·Filed 2012·Granted Nov 22, 2016·12 cites·20 claims
- 1690US9159686B2Crack stopper on under-bump metallization layerCHEN YU-FENG·Filed 2012·Granted Oct 13, 2015·11 cites·20 claims
- 1789US11075173B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 1889US9875388B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 23, 2018·4 cites·20 claims
- 1988US10373698B1Electronic device with a fuse array mechanismMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 6, 2019·5 cites·19 claims
- 2088US9397080B2Package on package devices and methods of packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·6 cites·20 claims
- 2188US2024386744A1Fingerprint Sensor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2287US9904776B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 27, 2018·3 cites·20 claims
- 2387US9735130B2Chip packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·8 cites·22 claims
- 2487US8994176B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·6 cites·20 claims
- 2586US9935081B2Hybrid interconnect for chip stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 3, 2018·8 cites·20 claims
- 2685US10878073B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·1 cites·20 claims
- 2785US10509938B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·2 cites·20 claims
- 2885US10354114B2Fingerprint sensor in InFO structure and formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 16, 2019·3 cites·20 claims
- 2985US10332609B1Systems and methods for improving fuse systems in memory devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 25, 2019·7 cites·19 claims
- 3085US9472524B2Copper-containing layer on under-bump metallization layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·4 cites·20 claims
- 3184US12394242B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 3284US10157274B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·2 cites·20 claims
- 3383US9209140B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·3 cites·20 claims
- 3483US8970033B2Extending metal traces in bump-on-trace structuresCHEN YU-FENG·Filed 2011·Granted Mar 3, 2015·7 cites·17 claims
- 3582US12260669B2Fingerprint sensor in InFO structure and formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 3682US12058101B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 3782US10020276B2Protrusion bump pads for bond-on-trace processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 10, 2018·3 cites·20 claims
- 3882US9898645B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·2 cites·20 claims
- 3980US10504856B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 10, 2019·2 cites·20 claims
- 4079US9484317B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·2 cites·20 claims
- 4178US9837346B2Packaging device having plural microstructures disposed proximate to die mounting regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 5, 2017·2 cites·20 claims
- 4277US11727714B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4377US10497424B2Systems and methods for plate voltage regulation during memory array accessMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 3, 2019·3 cites·10 claims
- 4477US10268872B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·1 cites·20 claims
- 4577US9508637B2Protrusion bump pads for bond-on-trace processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·3 cites·20 claims
- 4677US2024379584A1Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4776US9850126B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 26, 2017·2 cites·20 claims
- 4874US11741737B2Fingerprint sensor in info structure and formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 4974US11625940B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 5074US9666530B1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·2 cites·20 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →