Inventor · disambiguated record
Yu-Huan Chen
Also filed as: Chen yu-huan
23 granted patents·7 pending applications·22 citations·filing 2016–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD30
Top patents by PatentIndex Score
30 records- 0197US11275317B1Droplet generator and method of servicing a photolithographic toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 15, 2022·3 cites·20 claims
- 0295US12055864B2Droplet generator and method of servicing a photolithographic toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0395US11302537B2Chip package structure with conductive adhesive layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·3 cites·20 claims
- 0494US11747741B2Substrate stage, substrate processing system using the same, and method for processing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 0594US11553581B2Radiation source apparatus and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·2 cites·20 claims
- 0693US11533799B1System and method for supplying target material in an EUV light sourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·2 cites·20 claims
- 0791US12002746B2Chip package structure with metal-containing layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·1 cites·20 claims
- 0887US12066761B2Inspection tool for an extreme ultraviolet radiation source to observe tin residualTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·20 claims
- 0987US2025323139A1Chip package structure with protection elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1086US12405541B2Methods of servicing photolithographic apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 1186US12388003B2Chip package structure with metal-containing layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1286US11602037B1Apparatus and method for generating extreme ultraviolet radiationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·1 cites·20 claims
- 1386US11528797B2Method and system for generating droplets for EUV photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·1 cites·20 claims
- 1486US2025321503A1Extreme ultraviolet lithography toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1584US12111582B2Substrate stage and substrate processing system using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 1684US9748156B1Semiconductor package assembly, semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·4 cites·20 claims
- 1784US2024377762A1Semiconductor substrate stage for carring substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1883US2024387192A1Chip package structure with nickel layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1982US12125715B2Chip package structure with nickel layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 2081US2024361701A1Novel design of an inspection tool for an extreme ultraviolet radiation source to observe tin residualTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2177US11728180B2Chip package structure with conductive adhesive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 2274US12114411B2Apparatus and method for generating extreme ultraviolet radiationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2373US12096543B2Method for using radiation source apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 2472US12167526B2Method and system for generating droplets for EUV photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 2570US11335634B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 2665US11537053B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 2763US2025379131A1Package substrate including fiber-reinforced dielectric layer, package structure including the package substrate and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2860US11556065B2Wafer stage and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 2957US2025079327A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3054US11442365B1EUV photolithography system and methods of operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 13, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →