Inventor · disambiguated record
Yung-Shih Cheng
Also filed as: CHENG YUNG-SHIH
11 granted patents·14 pending applications·262 citations·filing 2012–2025
87Inventor score
Top patents by PatentIndex Score
25 records- 0196US9099530B2Methods of patterning small via pitch dimensionsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 4, 2015·108 cites·20 claims
- 0294US8728332B2Methods of patterning small via pitch dimensionsLIN CHUNG-YI·Filed 2012·Granted May 20, 2014·152 cites·19 claims
- 0389US11764143B2Increasing contact areas of contacts for MIM capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 19, 2023·2 cites·18 claims
- 0482US2025316577A1Increasing contact areas of contacts for mim capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0579US12230603B2Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0679US2025357310A1Passive Device StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0776US2024371757A1Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0873US12074107B2Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 0973US2024395728A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1072US2025183225A1Method of fabricating a semiconductor chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1170US2024145430A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1269US11756924B2Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 1367US11437313B2Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 1465US12165947B2Semiconductor devices and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 1565US12142574B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 1665US11908829B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1764US2023395488A1Passive Device StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1859US2025364435A1Wafer warpage reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1958US11923295B2Interconnect level with high resistance layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
- 2058US2025218891A1Integrated circuit (ic) structures with thermal path to carrier substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2158US2025191988A1Heat dissipation through seal ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2256US2025132254A1Semiconductor structures and methods with reduced plasma induced damageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2356US2025118665A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2456US2025098255A1Integrated circuit device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2553US2025096155A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →