Inventor · disambiguated record
Yuet Keung Cheung
Also filed as: CHEUNG YUET · CHEUNG YUET KEUNG
1 granted patent·3 pending applications·0 citations·filing 2017–2024
10Inventor score
Top patents by PatentIndex Score
4 records- 0153US2025112135A1Semiconductor packageNexperia BV·Filed 2024·Application pending·0 cites
- 0246US2024120247A1Method of Manufacturing a Semiconductor Package, Such Semiconductor Package as well as an Electronic System Comprising a PCB Element and at Least Such Semiconductor PackageNexperia BV·Filed 2023·Application pending·0 cites
- 0346US2024387427A1Semiconductor device package interconnect and manufacturing method thereofNexperia BV·Filed 2024·Application pending·0 cites
- 0443US10311597B2Apparatus and method of determining a bonding position of a dieASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jun 4, 2019·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →