Inventor · disambiguated record
Yuan-Hsin Chi
Also filed as: CHI YUAN-HSIN
14 granted patents·13 pending applications·3 citations·filing 2019–2025
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD27
Top patents by PatentIndex Score
27 records- 0187US11955317B2Radio frequency match strap assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
- 0281US11851325B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 26, 2023·2 cites·20 claims
- 0380US12234145B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0480US2024258072A1Radio frequency match strap assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0578US12002699B2Wafer pod transfer assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 0676US2025323072A1Wafer shift detectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0776US2024321616A1Wafer pod transfer assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0873US12466727B2Extended acid etch for oxide removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 0973US2024387233A1Clamp ring and method of using clamp ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1072US11600506B2Wafer pod transfer assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 1172US2024297085A1Power alarm and fire loading risk reduction for a deposition toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1270US11862482B2Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·8 claims
- 1370US2025154000A1Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1469US12394647B2Wafer shift detectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 1569US12040163B2Connect structure for semiconductor processing equipmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1667US12020994B2Power alarm and fire loading risk reduction for a deposition toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1766US12142514B2Clamp ring and method of using clamp ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 1865US12243848B2Methods and systems for improving fusion bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 1964US11655146B2Extended acid etch for oxide removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2064US2023383399A1Structures and methods for processing a semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2160US2025174595A1Methods and systems for improving fusion bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2259US2025323083A1Substrate carrying unit and substrate processing device having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2358US12286706B2Structures and methods for processing a semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 29, 2025·0 cites·20 claims
- 2455US2024084445A1Semiconductor wafer processing tool with improved leak checkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2555US2023065818A1Semiconductor apparatus for deposition processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2651US2023373100A1Transfer blade for robotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2748US2023375945A1Workpiece supportTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →