Inventor · disambiguated record
Yuan-Feng Chiang
Also filed as: CHIANG YUAN-FENG
14 granted patents·3 pending applications·10 citations·filing 2016–2024
85Inventor score
Files withADVANCED SEMICONDUCTOR ENG17
Top patents by PatentIndex Score
17 records- 0185US11837557B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 5, 2023·1 cites·19 claims
- 0281US11037853B1Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 0376US10211161B2Semiconductor package structure having a protection layerADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 19, 2019·3 cites·20 claims
- 0472US2025029940A1Semiconductor device package and the method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0568US11189576B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 30, 2021·1 cites·17 claims
- 0667US10663746B2Collimator, optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 26, 2020·1 cites·8 claims
- 0765US12272687B2Semiconductor device package with conductive pillars and reinforcing and encapsulating layersADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Apr 8, 2025·0 cites·6 claims
- 0864US11428946B2Method for manufacturing a through substrate viaADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·10 claims
- 0959US12107056B2Semiconductor device package and the method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 1, 2024·0 cites·10 claims
- 1053US11521958B2Semiconductor device package with conductive pillars and reinforcing and encapsulating layersADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 6, 2022·0 cites·6 claims
- 1152US11791227B2Electronic device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
- 1252US2024413115A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1344US10344383B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 9, 2019·0 cites·25 claims
- 1442US10325854B2Interposer and semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 1542US9947635B1Semiconductor package, interposer and semiconductor process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 17, 2018·0 cites·20 claims
- 1642US9929078B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 27, 2018·0 cites·19 claims
- 1736US2018342473A1Via structure, substrate structure including the same, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →