Inventor · disambiguated record
Yung-Ping Chiang
Also filed as: CHIANG YUNG-PING
27 granted patents·6 pending applications·47 citations·filing 2013–2025
94Inventor score
Top patents by PatentIndex Score
33 records- 0197US11855333B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0295US10157807B2Sensor packages and manufacturing mehtods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·10 cites·19 claims
- 0394US11929319B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0492US10636713B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·5 cites·20 claims
- 0589US11335666B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·16 claims
- 0687US10312203B2Structure and formation method of chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·4 cites·20 claims
- 0786US12266847B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 0886US11705411B2Chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 0986US9035468B2Copper post structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 19, 2015·8 cites·19 claims
- 1083US12205888B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1183US10978782B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 13, 2021·1 cites·20 claims
- 1282US11075159B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·2 cites·20 claims
- 1382US11004809B2Chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 1482US2024387359A1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1581US10879170B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 1678US2024387454A1Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1776US11515618B2Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 29, 2022·0 cites·20 claims
- 1876US10504865B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·2 cites·20 claims
- 1975US9543259B2Semiconductor structure with oval shaped conductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 10, 2017·2 cites·20 claims
- 2074US12148735B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 2174US2025329685A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2270US2025167161A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2362US9379076B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·1 cites·20 claims
- 2460US2025239561A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2558US11127708B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 2658US9343385B2Semiconductor device comprising a chip substrate, a mold, and a buffer layerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·0 cites·20 claims
- 2758US2025201747A1Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2854US10319692B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 11, 2019·0 cites·20 claims
- 2952US9728477B2Method of manufacturing a semiconductor device having scribe linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 8, 2017·0 cites·20 claims
- 3050US9397056B2Semiconductor device having trench adjacent to receiving area and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·0 cites·20 claims
- 3148US9343415B2Copper post structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 17, 2016·0 cites·20 claims
- 3247US9484308B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·0 cites·20 claims
- 3343US10937719B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 2, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →