Inventor · disambiguated record
Yuh-Harng Chien
Also filed as: CHIEN YUH-HARNG
19 granted patents·4 pending applications·11 citations·filing 2015–2024
89Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC23
Top patents by PatentIndex Score
23 records- 0191US9627331B1Method of making a wire support leadframe for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2015·Granted Apr 18, 2017·6 cites·20 claims
- 0288US10121733B2Wire support for a leadframeTEXAS INSTRUMENTS INC·Filed 2017·Granted Nov 6, 2018·4 cites·34 claims
- 0370US12040197B2Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 16, 2024·0 cites·17 claims
- 0470US2024274569A1Integrated circuit die pad cavityTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0566US11942448B2Integrated circuit die pad cavityTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·23 claims
- 0665US10573581B2LeadframeTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 25, 2020·1 cites·19 claims
- 0761US10811343B2Method of making a wire support leadframe for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2019·Granted Oct 20, 2020·0 cites·8 claims
- 0860US10529654B2Wire support for a leadframeTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 7, 2020·0 cites·17 claims
- 0959US10229868B2Method of making a wire support leadframe for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 12, 2019·0 cites·13 claims
- 1055US10340152B1Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 2, 2019·0 cites·9 claims
- 1154US2019326131A1Mechanical couplings designed to resolve process constraintsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 1253US11735506B2Packages with multiple exposed padsTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 22, 2023·0 cites·30 claims
- 1352US11862538B2Semiconductor die mounted in a recess of die padTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1450US11817374B2Electronic device with exposed tie barTEXAS INSTRUMENTS INC·Filed 2021·Granted Nov 14, 2023·0 cites·23 claims
- 1549US11444012B2Packaged electronic device with split die pad in robust package substrateTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 13, 2022·0 cites·19 claims
- 1649US10957631B2Angled die pad of a leadframe for a molded integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 23, 2021·0 cites·22 claims
- 1748US11742265B2Exposed heat-generating devicesTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 29, 2023·0 cites·16 claims
- 1848US2025038077A1Electronic device with lead lockTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1947US11081428B2Electronic device with three dimensional thermal padTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·22 claims
- 2046US2023317571A1Lead finger with z-direction obstruction featureTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2144US11081429B2Finger pad leadframeTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·24 claims
- 2242US11538740B2Leads for semiconductor packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 27, 2022·0 cites·8 claims
- 2341US10861777B2Wire bond clamp design and lead frame capable of engaging with sameTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 8, 2020·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →