Inventor · disambiguated record
Yung-Sheng Chiu
Also filed as: CHIU YUNG-SHENG
17 granted patents·12 pending applications·198 citations·filing 2000–2020
93Inventor score
Top patents by PatentIndex Score
29 records- 0188US7947588B2Structure and method for a CMOS device with doped conducting metal oxide as the gate electrodeTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 24, 2011·16 cites·18 claims
- 0286US6559539B2Stacked package structure of image sensorFiled 2001·Granted May 6, 2003·55 cites·10 claims
- 0385US8530263B2Superstrate solar cellLEE WEN-CHIN·Filed 2011·Granted Sep 10, 2013·4 cites·20 claims
- 0483US6590269B1Package structure for a photosensitive chipKINGPAK TECH INC·Filed 2002·Granted Jul 8, 2003·46 cites·2 claims
- 0582US6627983B2Stacked package structure of image sensorFiled 2001·Granted Sep 30, 2003·43 cites·12 claims
- 0680US9166094B2Method for forming solar cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 20, 2015·2 cites·15 claims
- 0780US9130113B2Method and apparatus for resistivity and transmittance optimization in TCO solar cell filmsTSMC SOLAR LTD·Filed 2012·Granted Sep 8, 2015·3 cites·15 claims
- 0876US8796063B2Superstrate solar cellTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 5, 2014·1 cites·20 claims
- 0976US8198685B2Transistors with metal gate and methods for forming the sameLIU CHUNG-SHI·Filed 2008·Granted Jun 12, 2012·6 cites·18 claims
- 1075US7898634B2Display panel with photo-curable sealant and manufacture method thereofAU OPTRONICS CORP·Filed 2008·Granted Mar 1, 2011·4 cites·26 claims
- 1173US8138076B2MOSFETs having stacked metal gate electrodes and methodLIN CHENG-TUNG·Filed 2008·Granted Mar 20, 2012·4 cites·15 claims
- 1264US8127167B2Methods for reducing power consumption and devices using the sameWANG CHAO CHUN·Filed 2009·Granted Feb 28, 2012·4 cites·18 claims
- 1362US6762554B2Electroluminescent device with drying film and method for fabricating the sameOPTO TECH CORP·Filed 2002·Granted Jul 13, 2004·7 cites·6 claims
- 1460US2014261691A1Thin film solar cell and fabrication method thereforTSMC SOLAR LTD·Filed 2014·Application pending·0 cites
- 1558US2020373443A1Thin film solar cell and method of forming sameTSMC SOLAR LTD·Filed 2020·Application pending·0 cites
- 1657US9105799B2Apparatus and method for producing solar cells using light treatmentTSMC SOLAR LTD·Filed 2013·Granted Aug 11, 2015·0 cites·19 claims
- 1752US8355107B2Display panel with photo-curable sealant and manufacture method thereofAU OPTRONICS CORP·Filed 2011·Granted Jan 15, 2013·0 cites·25 claims
- 1852US2013118569A1Method for forming thin film solar cell with buffer-free fabrication processLEE WEN-CHIN·Filed 2011·Application pending·0 cites
- 1946US10672925B2Thin film solar cell and method of forming sameTSMC SOLAR LTD·Filed 2013·Granted Jun 2, 2020·0 cites·20 claims
- 2045US6565008B2Module card and a method for manufacturing the sameKINGPAK TECH INC·Filed 2000·Granted May 20, 2003·3 cites·10 claims
- 2145US2013318363A1Security system for code dump protection and method thereofMEDIATEK INC·Filed 2013·Application pending·0 cites
- 2240US2009327750A1Security system for code dump protection and method thereofWU TSE-HONG·Filed 2008·Application pending·0 cites
- 2339US2005091551A1Operation mode switching method and apparatus for ensuring ultra low power consumptionFiled 2003·Application pending·0 cites
- 2438US2013075247A1Method and system for forming chalcogenide semiconductor materials using sputtering and evaporation functionsLEE WEN-CHIN·Filed 2011·Application pending·0 cites
- 2533US2002060287A1Structure of a photosensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 2632US2003116817A1Image sensor structureFiled 2001·Application pending·0 cites
- 2732US2002043709A1Stackable integrated circuitFiled 2001·Application pending·0 cites
- 2831US2002096729A1Stacked package structure of image sensorFiled 2001·Application pending·0 cites
- 2927US2002096747A1Package structure of an integrated circuitFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →