Inventor · disambiguated record
Yunhwa Choi
Also filed as: CHOI YUNHWA
5 granted patents·1 pending application·4 citations·filing 2016–2018
66Inventor score
Top patents by PatentIndex Score
6 records- 0176US10438873B2Semiconductor chip package having heat dissipating structureJMJ KOREA CO LTD·Filed 2017·Granted Oct 8, 2019·3 cites·3 claims
- 0265US10204848B2Semiconductor chip package having heat dissipating structureJMJ KOREA CO LTD·Filed 2018·Granted Feb 12, 2019·1 cites·5 claims
- 0341US11123400B2Broken or folded helical peptide or peptide analog exhibiting antimicrobial activity against gram-negative bacteria, and use thereofSEOUL NAT UNIV R&DB FOUNDATION·Filed 2016·Granted Sep 21, 2021·0 cites·3 claims
- 0438US11056420B2Pressing-type semiconductor power device packageJMJ KOREA CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·9 claims
- 0538US10256207B2Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the packageJMJ KOREA CO LTD·Filed 2018·Granted Apr 9, 2019·0 cites·4 claims
- 0630US2017207150A1Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the packageJMJ KOREA CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →