Inventor · disambiguated record
Yunseok Choi
Also filed as: CHOI YUNSEOK
34 granted patents·14 pending applications·95 citations·filing 2009–2025
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD40GOSANTECH CO LTD2CHOI YUNSEOK1HA JEONGOH1KOREA INST GEOSCIENCE & MINERAL RESOURCES1
Top patents by PatentIndex Score
48 records- 0195US11587859B2Wiring protection layer on an interposer with a through electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·5 cites·20 claims
- 0295US11195785B2Interposer with through electrode having a wiring protection layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 7, 2021·5 cites·20 claims
- 0394US11315886B2Semiconductor package having stiffening structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·18 claims
- 0493US8928132B2Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor packageCHOI YUNSEOK·Filed 2011·Granted Jan 6, 2015·42 cites·39 claims
- 0592US11770541B2Image encoder, image decoder, and image processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 0689US11848307B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 0785US11838651B2Image processing apparatus including neural network processor and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·2 cites·17 claims
- 0882US8330278B2Semiconductor package including a plurality of stacked semiconductor devicesLEE HEESEOK·Filed 2009·Granted Dec 11, 2012·13 cites·13 claims
- 0981US11784131B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·1 cites·11 claims
- 1078US12087019B2Image compression method using saturated pixel, encoder, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 10, 2024·1 cites·20 claims
- 1178US11627250B2Image compression method, encoder, and camera module including the encoderSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·1 cites·20 claims
- 1278US8823185B2Semiconductor packagesO IN WON·Filed 2011·Granted Sep 2, 2014·9 cites·19 claims
- 1376US12360457B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1476US10869308B2Apparatus and method for allocating resources in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·18 claims
- 1575US11838657B2Mobile electronic devices having multi-camera modulesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·1 cites·18 claims
- 1673US12142573B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1772US11653101B2Imaging system for generating high dynamic range imageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
- 1871US12212856B2Imaging system for generating high dynamic range imageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1969US11637963B2Image sensor and image processing system comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·18 claims
- 2069US2025100018A1Chemical mechanical polishing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2166US12044974B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 2264US11776918B2Semiconductor package having stiffening structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 2364US2025330718A1Image sensor processing merged image and image processing system comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2464US2025196166A1Nozzle module, substrate cleaning device and, substrate cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2562US12296602B2Ink supply system of ink-jet head provided with emergency drain function and ink-jet printer having sameGOSANTECH CO LTD·Filed 2023·Granted May 13, 2025·0 cites·12 claims
- 2662US12015803B2Camera module, image processing device and image compression methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 2760US12363446B2Image sensor processing merged image and image processing system comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 2859US12456633B2Wafer cleaning equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 2958US11823417B2Camera module, image processing system and image compression methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 3057US11570479B2Camera module, image processing device and image compression methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·21 claims
- 3157US2025028824A1Adversarial attack method and apparatusRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2024·Application pending·0 cites
- 3255US2024125960A1System and method for evaluating urban ground stability using traffic noiseKOREA INST GEOSCIENCE & MINERAL RESOURCES·Filed 2023·Application pending·0 cites
- 3354US11405623B2Image encoder, image decoder, and image processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 3453US11818369B2Image sensor module, image processing system, and image compression methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 3553US2023352411A1Semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3652US12169950B2Image sensor module, image processing system, and image compression methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 3752US2024096777A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3851US11395323B2Apparatus and method for managing uplink control channels in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·0 cites·23 claims
- 3951US2024071845A1Semiconductor package and package-on-package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4050US11758288B2Device for improving image resolution in camera system having lens that permits distortion and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·22 claims
- 4149US2025253258A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4249US2024222330A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4348US2013001798A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 4447US12172451B2Head assembly for ink-jet printer and ink-jet printer having the sameGOSANTECH CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·14 claims
- 4545US11765467B2Image sensor, electronic device including the image sensor and configured to generate output image data based on high conversion gain pixel signals, and low conversion gain pixel signals, and operating method therofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·21 claims
- 4645US2024128172A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4737US2016023323A1Carrier head and chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 4834US2012074595A1Semiconductor packageHA JEONGOH·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →