Inventor · disambiguated record
Yu-Chen Chou
Also filed as: CHOU YU-CHEN
16 granted patents·8 pending applications·159 citations·filing 2002–2024
93Inventor score
Files withADVANCED SEMICONDUCTOR ENG16CHOU YU-CHEN1CHUNGHWA PICTURE TUBES LTD1INNOLUX CORP1LIXEL INC1
Top patents by PatentIndex Score
24 records- 0181US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 0277US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 0375US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 0472US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 0572US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 0669US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 0762US2025191174A1Manufacturing method of electronic device and detection deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 0860US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 0956US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 1056US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 1155US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 1253US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 1348US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 1448US6743707B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 1, 2004·3 cites·10 claims
- 1547US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 1646US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 1745US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 1844US2020374507A1Stereo image display apparatus capable of enhancing image qualityLIXEL INC·Filed 2019·Application pending·0 cites
- 1941US2019195468A1Reflection filmCHUNGHWA PICTURE TUBES LTD·Filed 2018·Application pending·0 cites
- 2040US2005161812A1Wafer-level package structureFiled 2005·Application pending·0 cites
- 2139US2003161123A1Bonding structure for bonding substrates by metal studsFiled 2003·Application pending·0 cites
- 2238US2003146191A1Etching method for nickel-vanadium alloyFiled 2003·Application pending·0 cites
- 2337US2003160335A1Flip chip interconnection structure and fabrication process thereofFiled 2003·Application pending·0 cites
- 2433US2017203691A1Vehicle of no blind spotCHOU YU-CHEN·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →