Inventor · disambiguated record
Yung-Chi Chu
Also filed as: CHU YUNG-CHI
26 granted patents·10 pending applications·55 citations·filing 2018–2025
94Inventor score
Top patents by PatentIndex Score
36 records- 0198US11289396B2Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·13 cites·20 claims
- 0297US12087654B2Sensing die encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·4 cites·20 claims
- 0397US11894336B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·3 cites·20 claims
- 0497US11764124B2Sensing component encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·4 cites·20 claims
- 0596US11798893B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·2 cites·20 claims
- 0696US11798857B2Composition for sacrificial film, package, manufacturing method of packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 24, 2023·4 cites·20 claims
- 0793US11114407B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 7, 2021·7 cites·20 claims
- 0890US11694967B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 4, 2023·5 cites·19 claims
- 0989US11289426B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 29, 2022·4 cites·6 claims
- 1087US11164814B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·3 cites·20 claims
- 1187US2025323209A1Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1286US12494405B2Fabricating a sensing component encapsulated by an encapsulation layer with roughed surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 1385US2025118678A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1484US12412867B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1584US11869418B1Micro light emitting diode display panelPLAYNITRIDE DISPLAY CO LTD·Filed 2022·Granted Jan 9, 2024·2 cites·11 claims
- 1683US12205903B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1782US12283545B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 1882US11276647B2Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·1 cites·20 claims
- 1981US12315772B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 2081US11942417B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 26, 2024·1 cites·20 claims
- 2181US2025118682A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2281US2025226317A1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2380US2024088056A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2479US2024387306A1Manufacturing method of packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2579US2025246491A1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2678US12211802B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2777US11164839B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 2876US11854997B2Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2975US11862560B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 3066US2022384333A1Sensor Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3161US10607941B2Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 31, 2020·0 cites·20 claims
- 3255US12211815B2Micro LED display panelPLAYNITRIDE DISPLAY CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·10 claims
- 3355US2023109528A1Micro-led display devicePLAYNITRIDE DISPLAY CO LTD·Filed 2022·Application pending·0 cites
- 3454US12142601B2Micro light-emitting diode package structure and micro light-emitting diode display apparatusPLAYNITRIDE DISPLAY CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·14 claims
- 3553US11862614B2Micro LED display device and manufacturing method thereofPLAYNITRIDE DISPLAY CO LTD·Filed 2020·Granted Jan 2, 2024·0 cites·6 claims
- 3648US2022068999A1Micro-led display device and manufacturing method of the samePLAYNITRIDE DISPLAY CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →