Inventor · disambiguated record
Yuta Daijima
Also filed as: DAIJIMA YUTA
2 granted patents·5 pending applications·1 citations·filing 2017–2023
34Inventor score
Top patents by PatentIndex Score
7 records- 0172US12189290B2Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing methodRESONAC CORP·Filed 2023·Granted Jan 7, 2025·0 cites·18 claims
- 0268US11921424B2Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing methodHITACHI CHEMICAL CO LTD·Filed 2017·Granted Mar 5, 2024·1 cites·15 claims
- 0354US2025271758A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0453US2025116930A1Photosensitive resin composition, photosensitive element, printed circuit board, and method for manufacturing printed circuit boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0550US2025258430A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0645US2024134277A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0729US2019031790A1Photosensitive resin composition, dry film using same, printed wiring board, and method for manufacturing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →