Inventor · disambiguated record
Yue Deng
Also filed as: DENG YUE
11 granted patents·3 pending applications·18 citations·filing 2013–2022
84Inventor score
Top patents by PatentIndex Score
14 records- 0184US11721090B2Adversarial method and system for generating user preferred contentsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 8, 2023·6 cites·19 claims
- 0281US11720814B2Method and system for classifying time-series dataSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 8, 2023·4 cites·20 claims
- 0378US11669746B2System and method for active machine learningSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 6, 2023·3 cites·25 claims
- 0473US8930877B1Method and system of change evaluation of an electronic design for verification confirmationZIPALOG INC·Filed 2013·Granted Jan 6, 2015·3 cites·13 claims
- 0570US9147026B2Method and system of change evaluation of an electronic design for verification confirmationZIPALOG INC·Filed 2014·Granted Sep 29, 2015·2 cites·23 claims
- 0659US12476214B2Solder interconnect hierarchy for heterogeneous electronic device packagingINTEL CORP·Filed 2021·Granted Nov 18, 2025·0 cites·20 claims
- 0757US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 0856US11681923B2Multi-model structures for classification and intent determinationSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 20, 2023·0 cites·26 claims
- 0954US2024213198A1Under bump metallizations, solder compositions, and structures for die interconnects on integrated circuit packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 1050US9536028B2Method and system of change evaluation of an electronic design for verification confirmationZIPALOG INC·Filed 2015·Granted Jan 3, 2017·0 cites·20 claims
- 1149US11775815B2System and method for deep memory networkSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 3, 2023·0 cites·20 claims
- 1248US2023091379A1First level interconnect under bump metallizations for fine pitch heterogeneous applicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 1347US2023086920A1Dam surrounding a die on a substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 1443US11508983B2Automated batch sample preparation method for button batterySHENZHEN KEJING STAR TECH COMPANY·Filed 2020·Granted Nov 22, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →