Inventor · disambiguated record

Yunxiang Di

Also filed as: DI YUNXIANG

2 granted patents·2 citations·filing 2019–2023

39Inventor score

Technology areasH10W

Files withNINGBO SEMICONDUCTOR INT CORP1 NINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH1

Top patents by PatentIndex Score

2 records

0168US11695387B2Air gap type semiconductor device package structure and fabrication method thereofNINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH·Filed 2019·Granted Jul 4, 2023·2 cites·17 claims
0262US11979136B2Air gap type semiconductor device package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Granted May 7, 2024·0 cites·16 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →