Inventor · disambiguated record
Yuji Eguchi
Also filed as: EGUCHI YUJI
13 granted patents·7 pending applications·33 citations·filing 2003–2021
86Inventor score
Top patents by PatentIndex Score
20 records- 0184US9840485B1Bisfuran dihalide, method for producing bisfuran dihalide, and method for producing bisfuran diacid, bisfuran diol or bisfuran diamine using bisfuran dihalideSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Dec 12, 2017·3 cites·15 claims
- 0284US8349992B2Thermosetting resin having benzoxazine structure and method for producing the sameSEKISUI CHEMICAL CO LTD·Filed 2008·Granted Jan 8, 2013·6 cites·20 claims
- 0377US7819081B2Plasma film forming systemSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Oct 26, 2010·20 cites·10 claims
- 0472US11508688B2Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chipsSHINKAWA KK·Filed 2017·Granted Nov 22, 2022·2 cites·15 claims
- 0570US7994270B2Method for producing thermosetting resin having benzoxazine ringSEKISUI CHEMICAL CO LTD·Filed 2008·Granted Aug 9, 2011·2 cites·20 claims
- 0656US10221275B2Furan resin, method for producing same, thermosetting furan resin composition, cured product, and furan resin compositeSEKISUI CHEMICAL CO LTD·Filed 2015·Granted Mar 5, 2019·0 cites·10 claims
- 0755US10059700B2Supported catalyst for aldehyde coupling reaction , method for performing aldehyde coupling reaction, and method for regenerating supported catalyst for aldehyde coupling reactionSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Aug 28, 2018·0 cites·10 claims
- 0852US2006096539A1Plasma film forming systemSEKISUI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 0950US10007029B2β-phellandrene polymer, production method for same, and molded articleUNIV NAGOYA NAT UNIV CORP·Filed 2014·Granted Jun 26, 2018·0 cites·20 claims
- 1050US8026335B2Baked resin product and electronic device comprising the sameSEKISUI CHEMICAL CO LTD·Filed 2007·Granted Sep 27, 2011·0 cites·26 claims
- 1149US2009054614A1Method for producing thermosetting resin, thermosetting resin, thermosetting composition containing same, molded body, cured body, and electronic device containing thoseSEKISUI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 1247US11569192B2Method for producing structure, and structureSHINKAWA KK·Filed 2018·Granted Jan 31, 2023·0 cites·18 claims
- 1347US2022319891A1Manufacturing apparatus and manufacturing method of semiconductor deviceSHINKAWA KK·Filed 2021·Application pending·0 cites
- 1446US8183368B2Thermosetting compound, composition containing the same, and molded articleEGUCHI YUJI·Filed 2006·Granted May 22, 2012·0 cites·3 claims
- 1546US2024063049A1Suction device, suction unit, suction method, and computer-readable recording mediumSHINKAWA KK·Filed 2021·Application pending·0 cites
- 1645US11749541B2Bonding apparatusSHINKAWA KK·Filed 2020·Granted Sep 5, 2023·0 cites·7 claims
- 1740US2009187003A1Thermosetting resin, thermosetting composition containing same, and molded product obtained from sameEGUCHI YUJI·Filed 2006·Application pending·0 cites
- 1837US7299670B2Method and apparatus for producing cylindrical components having bent portionsDENSO CORP·Filed 2006·Granted Nov 27, 2007·0 cites·9 claims
- 1933US2017335053A1Ester-type epoxy furan resin and manufacturing method therefor, resin composition, and cured resin productSEKISUI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 2030US2005208215A1Oxide film forming method and oxide film forming apparatusEGUCHI YUJI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →