Inventor · disambiguated record
Yuxin Fang
Also filed as: FANG YUXIN
1 granted patent·9 pending applications·0 citations·filing 2019–2024
13Inventor score
Top patents by PatentIndex Score
10 records- 0168US2023287579A1Electrochemical reactor for upgrading methane and small alkanes to longer alkanes and alkenesUNIV LOUISIANA STATE·Filed 2023·Application pending·0 cites
- 0260US11591699B2Electrochemical reactor for upgrading methane and small alkanes to longer alkanes and alkenesUNIV LOUISIANA STATE·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 0357US2025293122A1Multi-die assemblies with glass support structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0454US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 0553US2025218911A1Electrolytic cobalt-iron-palladium-gold as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 0653US2025219002A1Electrolytic indium-palladium-gold as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 0752US2025218910A1Immersion gold-electroless palladium-immersion gold (igepig) as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 0852US2025004225A1Technologies for substrate features for a pluggable optical connectorINTEL CORP·Filed 2023·Application pending·0 cites
- 0952US2025218925A1Electroless nickel-electroless palladium-immersion gold (enepig) with thin nickel layer as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
- 1052US2025218924A1Electroless nickel-electroless palladium-immersion gold (enepig) as a surface finish for embedded die attachmentsINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →