Inventor · disambiguated record
Yung-Sheng Fang
Also filed as: FANG YUNG-SHENG
17 granted patents·2 pending applications·14 citations·filing 2013–2025
87Inventor score
Top patents by PatentIndex Score
19 records- 0194US11411560B1Electronic system, integrated circuit die and operation method thereofGLOBAL UNICHIP CORP·Filed 2021·Granted Aug 9, 2022·5 cites·35 claims
- 0292US11063596B1Frame decoding circuit and method for performing frame decodingGLOBAL UNICHIP CORP·Filed 2021·Granted Jul 13, 2021·4 cites·26 claims
- 0387US11474554B2Circuit for providing clock to de-serializer in communication physical layerGLOBAL UNICHIP CORP·Filed 2021·Granted Oct 18, 2022·3 cites·18 claims
- 0487US11031923B1Interface device and interface method for 3D semiconductor deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
- 0575US12292850B2Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2023·Granted May 6, 2025·0 cites·13 claims
- 0675US2025225101A1Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2025·Application pending·0 cites
- 0775US2025225100A1Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2025·Application pending·0 cites
- 0856US12438654B2Communication system between dies and repairing method for lanes between diesGLOBAL UNICHIP CORP·Filed 2023·Granted Oct 7, 2025·0 cites·24 claims
- 0956US11955312B2Physical analysis method, sample for physical analysis and preparing method thereofMATERIALS ANALYSIS TECH INC·Filed 2021·Granted Apr 9, 2024·0 cites·28 claims
- 1054US12093202B2DBI encoding device and DBI encoding methodGLOBAL UNICHIP CORP·Filed 2022·Granted Sep 17, 2024·0 cites·18 claims
- 1153US11144485B1Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Oct 12, 2021·0 cites·26 claims
- 1251US11687472B2Interface for semiconductor device and interfacing method thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 27, 2023·0 cites·22 claims
- 1350US11699683B2Semiconductor device in 3D stack with communication interface and managing method thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Jul 11, 2023·0 cites·16 claims
- 1449US12235717B2Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Feb 25, 2025·0 cites·16 claims
- 1549US11675731B2Data protection system and method thereof for 3D semiconductor deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 1642US11902171B2Communication system between dies and operation method thereofGLOBAL UNICHIP CORP·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
- 1738US9244122B2Method of determining performance of a chip of an integrated-circuit design and an apparatus and an integrated circuit using the sameChen shi-hao·Filed 2013·Granted Jan 26, 2016·0 cites·11 claims
- 1835US10145896B2Electronic device, performance binning system and method, voltage automatic calibration systemGLOBAL UNICHIP CORP·Filed 2015·Granted Dec 4, 2018·0 cites·3 claims
- 1934US9304959B2Method of optimizing the width of transaction ID for an interconnecting busLIAO YING-ZE·Filed 2013·Granted Apr 5, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →