Inventor · disambiguated record
Yufeng Feng
Also filed as: FENG YUFENG
1 granted patent·1 pending application·5 citations·filing 2010–2023
26Inventor score
Top patents by PatentIndex Score
2 records- 0165US9105647B2Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill materialHU JUNWEI·Filed 2010·Granted Aug 11, 2015·5 cites·14 claims
- 0249US2024217410A1Method for attaching trim to a seat cushion and trim-covered seat cushionLEAR CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →