Inventor · disambiguated record
Yuqing Gong
Also filed as: GONG YUQING
3 granted patents·59 citations·filing 2012–2019
70Inventor score
Files withXILINX INC3
Top patents by PatentIndex Score
3 records- 0196US10262911B1Circuit for and method of testing bond connections between a first die and a second dieXILINX INC·Filed 2016·Granted Apr 16, 2019·51 cites·20 claims
- 0291US11073550B1Test vehicle for package testingXILINX INC·Filed 2019·Granted Jul 27, 2021·5 cites·19 claims
- 0370US8810269B2Method of testing a semiconductor structureXILINX INC·Filed 2012·Granted Aug 19, 2014·3 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →