Inventor · disambiguated record
Yusuke Harada
Also filed as: HARADA YUSUKE
23 granted patents·5 pending applications·192 citations·filing 1990–2025
95Inventor score
Files withOKI ELECTRIC IND CO LTD14ROHM CO LTD6FUJI XEROX CO LTD2HARADA YUSUKE2ASAHI KASEI MICRODEVICES CORP1
Top patents by PatentIndex Score
28 records- 0175US6767812B2Method of forming CVD titanium filmOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 27, 2004·14 cites·25 claims
- 0273US10354936B2Electronic component having a heat dissipation member formed on a sealing memberROHM CO LTD·Filed 2017·Granted Jul 16, 2019·2 cites·19 claims
- 0372US8786087B2Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrateHARADA YUSUKE·Filed 2010·Granted Jul 22, 2014·3 cites·6 claims
- 0472US5332643AMethod of wet honing a support for an electrophotographic photoreceptorFUJI XEROX CO LTD·Filed 1993·Granted Jul 26, 1994·21 cites·17 claims
- 0571US2023207444A1Semiconductor device and method for manufacturing the sameROHM CO LTD·Filed 2023·Application pending·0 cites
- 0669US11616009B2Method of manufacturing semiconductor device with internal and external electrodeROHM CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·3 claims
- 0768US6759747B2Semiconductor device having damascene interconnection structure that prevents void formation between interconnectionsOKI ELECTRIC IND CO LTD·Filed 2002·Granted Jul 6, 2004·10 cites·19 claims
- 0862US5166023AElectrophotographic photoreceptor and related methodFUJI XEROX CO LTD·Filed 1990·Granted Nov 24, 1992·14 cites·5 claims
- 0960US2024332101A1Semiconductor deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 1059US11004782B2Semiconductor device with internal and external electrode and method of manufacturingROHM CO LTD·Filed 2019·Granted May 11, 2021·0 cites·15 claims
- 1158US2025103543A1Slave device, communication system, imaging device, master device, and data communication methodASAHI KASEI MICRODEVICES CORP·Filed 2024·Application pending·0 cites
- 1257US6400031B1Semiconductor device having damascene interconnection structure that prevents void formation between interconnectionsOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jun 4, 2002·15 cites·13 claims
- 1355US2025372486A1Semiconductor deviceROHM CO LTD·Filed 2025·Application pending·0 cites
- 1454US7777337B2Semiconductor device having damascene interconnection structure that prevents void formation between interconnectionsOKI SEMICONDUCTOR CO LTD·Filed 2003·Granted Aug 17, 2010·4 cites·30 claims
- 1554US7176577B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 13, 2007·4 cites·14 claims
- 1654US6780764B2Method of forming a patterned tungsten damascene interconnectOKI ELECTRIC IND CO LTD·Filed 2002·Granted Aug 24, 2004·7 cites·5 claims
- 1754US6706645B2Method of manufacturing a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Mar 16, 2004·4 cites·19 claims
- 1854US5646449ASemiconductor device having a multi-layered conductive structure which includes an aluminum alloy layer, a high melting temperature metal layer, and a high melting temperature nitride layerOKI ELECTRIC IND CO LTD·Filed 1995·Granted Jul 8, 1997·18 cites·8 claims
- 1953US6458716B1Method of manufacturing a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 1, 2002·4 cites·14 claims
- 2052US5006484AMaking a semiconductor device with contact holes having different depthsOKI ELECTRIC INDUSTRY INC CO·Filed 1990·Granted Apr 9, 1991·27 cites·13 claims
- 2145US7126222B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Oct 24, 2006·1 cites·20 claims
- 2245US6924176B2Method of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Aug 2, 2005·2 cites·29 claims
- 2341US5192713AMethod of manufacturing semiconductor devices having multi-layered structureOKI ELECTRIC IND CO LTD·Filed 1991·Granted Mar 9, 1993·13 cites·14 claims
- 2441US5126825AWiring structure of a semiconductor device with beta tungstenOKI ELECTRIC IND CO LTD·Filed 1990·Granted Jun 30, 1992·13 cites·9 claims
- 2539US2012312437A1Motorcycle tireHARADA YUSUKE·Filed 2012·Application pending·0 cites
- 2637US6306762B1Semiconductor device having multi-layered metalization and method of manufacturing the sameELECTRIC INDUSTRY CO LTD·Filed 1996·Granted Oct 23, 2001·7 cites·16 claims
- 2737US5128278AMethod of forming a wiring pattern for a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1990·Granted Jul 7, 1992·9 cites·7 claims
- 2828US5982037AAl/Ti layered interconnection and method of forming sameOKI ELECTRIC IND CO LTD·Filed 1997·Granted Nov 9, 1999·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →