Inventor · disambiguated record
Yuseon Heo
Also filed as: HEO YUSEON
2 granted patents·7 pending applications·3 citations·filing 2020–2025
45Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0185US11462487B2Semiconductor package including photo imageable dielectric and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·3 cites·19 claims
- 0273US2025323181A1Semiconductor package including photo imageable dielectricSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0365US12354974B2Semiconductor package including photo imageable dielectricSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
- 0457US2025118639A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0555US2024234165A9Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0653US2024080994A1Methods of reducing defects from pattern misalignmentSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0752US2024136332A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0850US2025054773A1Formation method of plating pattern and semiconductor package including plating pattern layer formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0948US2025087544A1Semiconductor package with binding reinforcement layerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →