Inventor · disambiguated record
Yuichiro Hinata
Also filed as: HINATA YUICHIRO
14 granted patents·10 pending applications·22 citations·filing 2014–2025
85Inventor score
Technology areasH10W
Files withFUJI ELECTRIC CO LTD24
Top patents by PatentIndex Score
24 records- 0176US11133609B2Semiconductor device having terminal pin connected by connecting member and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Sep 28, 2021·2 cites·17 claims
- 0271USD827591SSemiconductor moduleFUJI ELECTRIC CO LTD·Filed 2017·Granted Sep 4, 2018·16 cites·1 claims
- 0368US10242961B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Mar 26, 2019·2 cites·4 claims
- 0467US10903130B2Semiconductor apparatus and manufacturing method of semiconductor apparatusFUJI ELECTRIC CO LTD·Filed 2017·Granted Jan 26, 2021·1 cites·12 claims
- 0562US2025149496A1Semiconductor module and method of manufacturing a semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0659US9601404B2Thermal resistance measuring method and thermal resistance measuring deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Mar 21, 2017·1 cites·11 claims
- 0759US2024222311A1Semiconductor device having connection wiring to which wire is connectedFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0858US2024312948A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0958US2024429206A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1057US2024243093A1Semiconductor module and wiring memberFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1156US12046539B2Semiconductor module comprising a resin case and an external connection terminalFUJI ELECTRIC CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 1255US11437302B2Semiconductor module and method for manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2021·Granted Sep 6, 2022·0 cites·13 claims
- 1355US2024071898A1Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1455US2024250015A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1554US12057367B2Semiconductor device and method for manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·17 claims
- 1653US11610826B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 1753US2023142695A1Semiconductor device and manufacturing method thereforFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 1852US11191157B2Semiconductor device having buffer structure for external terminalsFUJI ELECTRIC CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·7 claims
- 1951US12230600B2Semiconductor device having through parts of different shapesFUJI ELECTRIC CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·10 claims
- 2050US2025300046A1Semiconductor device and manufacturing method thereforFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2146US11171078B2Semiconductor device and method for manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·17 claims
- 2240US11682596B2Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·8 claims
- 2338US10204871B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2017·Granted Feb 12, 2019·0 cites·18 claims
- 2433US2017271224A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →