Inventor · disambiguated record
Yuichi Hirano
Also filed as: HIRANO YUICHI
16 granted patents·6 pending applications·102 citations·filing 1997–2022
92Inventor score
Files withTOYOTA MOTOR CO LTD8HIRANO YUICHI3MITSUBISHI ELECTRIC CORP3RENESAS ELECTRONICS CORP3RENESAS TECH CORP2
Top patents by PatentIndex Score
22 records- 0189US8912590B2Semiconductor device including monos-type memory cellHIRANO YUICHI·Filed 2012·Granted Dec 16, 2014·10 cites·8 claims
- 0285US9805459B2Axial force measurement methodTOYOTA MOTOR CO LTD·Filed 2014·Granted Oct 31, 2017·10 cites·5 claims
- 0385US9190333B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 17, 2015·5 cites·18 claims
- 0482US10840244B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 17, 2020·3 cites·20 claims
- 0579US10325362B2Bolt axial tension measuring apparatus and bolt axial tension measuring methodTOYOTA MOTOR CO LTD·Filed 2017·Granted Jun 18, 2019·3 cites·4 claims
- 0678US10533849B2Analysis apparatus and analysis programTOYOTA MOTOR CO LTD·Filed 2019·Granted Jan 14, 2020·3 cites·7 claims
- 0773US7804132B2Semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Sep 28, 2010·5 cites·8 claims
- 0871US6335267B1Semiconductor substrate and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 1, 2002·12 cites·15 claims
- 0970US8513058B2Semiconductor device and method for producing the sameIWAMATSU TOSHIAKI·Filed 2011·Granted Aug 20, 2013·3 cites·16 claims
- 1069US6150696ASemiconductor substrate and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Nov 21, 2000·30 cites·4 claims
- 1163US8878301B2Semiconductor device with transistors having different source/drain region depthsHIRANO YUICHI·Filed 2011·Granted Nov 4, 2014·2 cites·12 claims
- 1256US11420222B2Vehicle painting method and painting systemTOYOTA MOTOR CO LTD·Filed 2019·Granted Aug 23, 2022·0 cites·10 claims
- 1356US11288791B2Component discrimination apparatus and method for discriminating componentTOYOTA MOTOR CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·7 claims
- 1451US2011269089A1Heat treatment apparatus for solar cellsHONDA MOTOR CO LTD·Filed 2009·Application pending·0 cites
- 1551US2022135159A1Method for manufacturing vehicleTOYOTA MOTOR CO LTD·Filed 2021·Application pending·0 cites
- 1650US6191450B1Semiconductor device with field shield electrodeMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Feb 20, 2001·16 cites·16 claims
- 1750US2016043221A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1849US12393438B2Information processing systemTOYOTA MOTOR CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·3 claims
- 1945US2010314686A1Semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 2044US2014302646A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 2143US11480484B2Axial-force measurement method, tightening determination method, axial-force measurement apparatus, and tightening determination apparatus for boltTOYOTA MOTOR CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·7 claims
- 2240US2008179676A1Semiconductor memory deviceHIRANO YUICHI·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →