Inventor · disambiguated record
Yuya Hirayama
Also filed as: HIRAYAMA YUYA
7 granted patents·4 pending applications·0 citations·filing 2017–2023
67Inventor score
Files withFUJIFILM BUSINESS INNOVATION CORP5HITACHI CHEMICAL CO LTD2SHOWA DENKO MATERIALS CO LTD2JAPAN WIND TUNNEL MFG INC1RESONAC CORP1
Top patents by PatentIndex Score
11 records- 0165US12489852B2Information processing apparatus, non-transitory computer readable medium storing program, and information processing methodFUJIFILM BUSINESS INNOVATION CORP·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 0262US11691389B2Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·13 claims
- 0361US2025243363A1Heat-curable resin composition, prepreg, resin film, laminate, printed wiring board, antenna device, antenna module, and communication deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0455US2024231352A1Management apparatus, non-transitory computer readable medium, and management systemFUJIFILM BUSINESS INNOVATION CORP·Filed 2023·Application pending·0 cites
- 0554US2019161586A1Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0652US11546485B2Information processing apparatus and semiconductor deviceFUJIFILM BUSINESS INNOVATION CORP·Filed 2019·Granted Jan 3, 2023·0 cites·10 claims
- 0752US2023145264A1Photosensitive resin composition, photosensitive element, and method for producing wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0845US11375080B2Information processing apparatus and semiconductor device for writing data to a volatile memory through pluarl communication pathwayFUJIFILM BUSINESS INNOVATION CORP·Filed 2019·Granted Jun 28, 2022·0 cites·7 claims
- 0941US11593151B2Information processing apparatus and semiconductor deviceFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Feb 28, 2023·0 cites·10 claims
- 1038US12258468B2Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2019·Granted Mar 25, 2025·0 cites·9 claims
- 1117USD1013855SAxial fan unit for wind tunnel testsJAPAN WIND TUNNEL MFG INC·Filed 2021·Granted Feb 6, 2024·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →