Inventor · disambiguated record
Yuto Hiyama
Also filed as: HIYAMA YUTO
1 granted patent·1 pending application·0 citations·filing 2011–2013
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2 records- 0150US10062473B2Silver-coated copper alloy powder and method for producing sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2013·Granted Aug 28, 2018·0 cites·30 claims
- 0238US2013153835A1Low-temperature sintering conductive paste, conductive film using the same, and method for forming conductive filmHINOTSU TAKASHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →