Inventor · disambiguated record

Yuki Hoga

Also filed as: HOGA YUKI

1 granted patent·0 citations·filing 2018–2018

10Inventor score

Technology areasC09J

Files withOMRON TATEISI ELECTRONICS CO1

Top patents by PatentIndex Score

1 record

0155US11773296B2Method for curing adhesive composition and method for manufacturing bonded structureOMRON TATEISI ELECTRONICS CO·Filed 2018·Granted Oct 3, 2023·0 cites·7 claims

Join the waitlist — get patent alerts

Get an alert when Yuki Hoga files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →