Inventor · disambiguated record
Yukio Honkawa
Also filed as: HONKAWA YUKIO
8 granted patents·13 citations·filing 2001–2019
78Inventor score
Top patents by PatentIndex Score
8 records- 0165US6768759B2Semiconductor laser device and method for fabricating the sameFURUKAWA ELECTRIC CO LTD·Filed 2001·Granted Jul 27, 2004·8 cites·5 claims
- 0262US11519090B2Method and apparatus for producing electrolytic aluminum foilUACJ CORP·Filed 2019·Granted Dec 6, 2022·0 cites·10 claims
- 0362US7563630B2Method for fabricating a semiconductor laser device that includes growing current confinement layers and a mesa side surfaceFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Jul 21, 2009·1 cites·21 claims
- 0461US11035047B2Electrolytic aluminum foil and method of manufacturing sameUACJ CORP·Filed 2019·Granted Jun 15, 2021·0 cites·4 claims
- 0556US10590555B2Method for producing electrolytic aluminum foilUACJ CORP·Filed 2017·Granted Mar 17, 2020·0 cites·6 claims
- 0656US7145930B2Semiconductor laser device and method for fabricating the sameFURUKAWA ELECTRIC CO LTD·Filed 2004·Granted Dec 5, 2006·4 cites·6 claims
- 0750US11225725B2Method for producing aluminumUACJ CORP·Filed 2019·Granted Jan 18, 2022·0 cites·5 claims
- 0846US11560641B2Surface-treated aluminum material having excellent adhesiveness to resins, method for manufacturing the same, and surface-treated aluminum material-resin bonded bodyUACJ CORP·Filed 2016·Granted Jan 24, 2023·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →