Inventor · disambiguated record
Yusuke Horiguchi
Also filed as: HORIGUCHI YUSUKE
9 granted patents·6 pending applications·31 citations·filing 2006–2023
82Inventor score
Files withHENKEL AG & CO KGAA5HORIGUCHI YUSUKE3Henkel IP & Holding GmbH2SKYWORKS SOLUTIONS INC2NISSAN CHEMICAL IND LTD1
Top patents by PatentIndex Score
15 records- 0190US8048615B2Silicon-containing resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coatingNISSAN CHEMICAL IND LTD·Filed 2006·Granted Nov 1, 2011·17 cites·10 claims
- 0281US8481247B2Resist underlayer film forming composition containing liquid additiveHORIGUCHI YUSUKE·Filed 2007·Granted Jul 9, 2013·9 cites·5 claims
- 0364US10242923B2Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packagesHenkel IP & Holding GmbH·Filed 2018·Granted Mar 26, 2019·1 cites·21 claims
- 0463US9436085B2Composition for forming photosensitive resist underlayer filmHORIGUCHI YUSUKE·Filed 2010·Granted Sep 6, 2016·1 cites·2 claims
- 0557US11203181B2Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packagesHenkel IP & Holding GmbH·Filed 2018·Granted Dec 21, 2021·0 cites·9 claims
- 0656US2024097640A1Bulk acoustic wave device packaging with redistribution using buffer coat insulationSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 0752US2023115592A1Bulk acoustic wave device packaging with redistribution using silicon dioxide insulationSKYWORKS SOLUTIONS INC·Filed 2022·Application pending·0 cites
- 0850US9334429B2Underfill sealant compositionHENKEL AG & CO KGAA·Filed 2014·Granted May 10, 2016·0 cites·7 claims
- 0949US2014187714A1Sealant composition for electronic deviceHENKEL AG & CO KGAA·Filed 2014·Application pending·0 cites
- 1047US8227172B2Method of producing semiconductor device using resist underlayer film by photo-crosslinking curingHORIGUCHI YUSUKE·Filed 2007·Granted Jul 24, 2012·3 cites·3 claims
- 1146US9576871B2Composition for electronic deviceHENKEL AG & CO KGAA·Filed 2014·Granted Feb 21, 2017·0 cites·8 claims
- 1245US9771500B2Sealant composition for electronic deviceHENKEL AG & CO KGAA·Filed 2016·Granted Sep 26, 2017·0 cites·10 claims
- 1343US2020009830A1Worklife improvement for multilayer comprising at least one underfill film and methods for the preparation and use thereofHENKEL AG & CO KGAA·Filed 2019·Application pending·0 cites
- 1436US2015335127A1Hair dryerSANFAT ELECTRIC MFG COMPANY LTD·Filed 2015·Application pending·0 cites
- 1529US2012288795A1Composition for formation of photosensitive resist underlayer film and method for formation of resist patternUMEZAKI MAKIKO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →